Substrate-less Coupled Inductor with Filler
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Solution Overview
Problem
Traditional discrete coupled inductor structures require custom cores and windings, making them expensive and not suitable for compact semiconductor devices, where a cost-effective and space-efficient solution is needed.
Innovation Solution
A substrate-less discrete coupled inductor structure is developed, featuring two inductor windings with a filler providing structural coupling, which are designed to be thin and integrated into semiconductor packages without a substrate, using a sacrificial layer process to form the windings and removing the substrate for compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional ladder structure with custom core and windings is used, then coupling efficiency is improved, but manufacturing cost increases and device area increases
Solution Approach 1:
The patent uses standard off-the-shelf inductor components instead of custom-designed inductors, copying proven commercial designs to reduce manufacturing complexity and cost while maintaining acceptable coupling efficiency through alternative structural arrangements
Solution Approach 2:
The patent combines multiple standard inductor components into a coupled inductor assembly, merging their functions to achieve the required coupling efficiency without needing custom single-piece cores, thereby reducing manufacturing cost and improving ease of assembly
2Reliability
If traditional ladder structure with custom core and windings is used, then coupling efficiency is improved, but device area increases
Solution Approach 1:
The patent transitions from planar ladder structures to three-dimensional stacked configurations, utilizing vertical space to achieve coupling efficiency while minimizing the horizontal footprint and overall device area
3Strength
If substrate is used for inductor structure, then structural support is provided, but device area and complexity increase
Solution Approach 1:
The patent removes the substrate from the inductor structure, extracting only the essential magnetic coupling function and supporting elements, thereby reducing device area and simplifying the overall structure while maintaining adequate structural support through alternative means
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a cost-effective, compact coupled inductor structure with improved coupling efficiency and a higher Q factor, suitable for integration in various electronic devices such as smartphones and laptops, while occupying minimal space.
Implementation Method 1
a filler laterally located between the first inductor winding and the second inductor winding, wherein the filler is configured to provide structural coupling of the first and second inductor windings
Implementation Method 2
a first inductor winding that includes an electrically conductive material... a second inductor winding that includes an electrically conductive material
Data Source
AI summary
Some novel features pertain to an inductor structure that includes a first inductor winding, a second inductor winding and a filler. The first inductor winding includes an electrically conductive material. The second inductor winding includes an electrically conductive material. The filler is laterally located between the first inductor winding and the second inductor winding. The filler is configured to provide structural coupling of the first and second inductor windings. In some implementations, the first inductor winding is laterally co-planar to the second inductor winding. In some implementations, the first inductor winding has a first spiral shape and the second inductor winding has a second spiral shape. In some implementations, the first inductor winding and the second inductor winding have an elongated circular shape. In some implementations, the filler is an epoxy.