Substrate-less Integrated Components for Thin Electronic Packages
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Solution Overview
Problem
Conventional plastic ball grid array (BGA) substrate packaging techniques face challenges in achieving thinner, lower profile packages with higher density, particularly in mobile devices, as they require thinner core layers and coreless substrates to meet miniaturization needs while maintaining reliability and cost-effectiveness.
Innovation Solution
The development of substrate-less packaging methods involving a de-bondable carrier for strip or panel-based manufacturing, where components are attached face-down, encapsulated in a molding compound, and singulated with exposed terminals, allowing for the application of solder bumps and integrated electromagnetic interference (EMI) shielding structures, including trench and fill techniques for EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional BGA substrate strip is used, then structural support and routing are provided, but package thickness (z-height) is increased and miniaturization is limited
Solution Approach 1:
The patent removes the conventional BGA substrate strip entirely from the package structure. Components are mounted directly on a carrier without requiring a separate substrate layer, thereby eliminating the substrate thickness contribution to overall package height and enabling miniaturization while maintaining all necessary functional capabilities through direct component-to-carrier integration
Solution Approach 2:
The patent merges the substrate functions (structural support, routing, component mounting) directly into the carrier structure. The carrier simultaneously serves as both the mounting platform and the functional substrate, eliminating the need for separate substrate layers and reducing overall package complexity and thickness
2Length of moving object
If core layer thickness is reduced or coreless substrates are fabricated, then lower profile packages are achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent eliminates the core layer entirely by using a carrier-based architecture where components are mounted directly on the carrier surface. This removes the need for complex core layer fabrication, glass cloth reinforcement, and build-up layer processes, significantly simplifying manufacturing while achieving lower profile packages
Solution Approach 2:
The patent employs a disposable carrier that is removed after the packaging process. The carrier serves its purpose during assembly and encapsulation, then is discarded, eliminating the need for permanent, complex substrate structures and reducing manufacturing costs associated with high-precision substrate fabrication
3Productivity
If components are mounted on BGA substrate strip, then standard packaging process is used, but package density and integration level are limited
Solution Approach 1:
The patent combines multiple packaging functions into a single integrated process: component mounting, encapsulation, and carrier removal are performed in sequence on the same carrier structure. This merging of functions enables higher package density by eliminating intermediate substrate layers and simplifying the overall packaging architecture
Solution Approach 2:
The patent transitions from traditional planar substrate mounting to a vertical integration approach where components are mounted face-down on the carrier and then encapsulated. This dimensional reorganization allows for higher component density and better space utilization while maintaining manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of thin, miniaturized, and cost-effective packages with reduced z-height, compatible with conventional BGA or chip scale packaging infrastructure, facilitating surface mounting with good yield and reliability, and eliminating the need for a conventional BGA substrate strip.
Implementation Method 1
encapsulating the plurality of components within a molding compound
Implementation Method 2
attaching a ground structure to a carrier
Implementation Method 3
solder bumps can be applied to the exposed plurality of ground structure terminals
Implementation Method 4
integrated electromagnetic interference (EMI) shielding structures
Data Source
AI summary
Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.