Substrate-less Electronic Package with Thick Metal Member for Heat Dissipation
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Solution Overview
Problem
Existing electronic component packaging techniques face challenges in heat dissipation, cost, and reliability of solder connections, particularly due to the use of circuit boards and lead frames, which hinder high package density and increase manufacturing costs.
Innovation Solution
An electronic component package with a metal pattern layer, a sealing resin layer, and an insulating layer, where the metal member is thicker than the component and positioned in the peripheral area, allowing for efficient heat dissipation and fine machining, and a substrate-less structure that reduces costs and improves solder connection reliability during second-level packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a circuit board or lead frame is used for packaging electronic components, then the package structure is simple and easy to manufacture, but heat dissipation performance deteriorates and package density is limited
Solution Approach 1:
The patent changes the material parameter from traditional circuit board/lead frame to metal plate with metal pattern layer, and adjusts the thickness parameter of the metal member to be greater than the electronic component thickness, thereby improving heat dissipation performance while maintaining manufacturing feasibility
Solution Approach 2:
The patent uses a composite structure consisting of metal plate, metal pattern layer, sealing resin layer, and insulating layer, combining the advantages of different materials to achieve both good heat dissipation and ease of manufacture
2Ease of manufacture
If a circuit board or lead frame is used for packaging, then manufacturing process is simple, but package density and solder connection reliability deteriorate
Solution Approach 1:
The patent changes the substrate material parameter to metal plate and adjusts the thickness ratio between metal member and electronic component, enabling better solder connection reliability through improved thermal performance during reflow soldering while keeping the manufacturing process relatively simple
Solution Approach 2:
The metal plate serves multiple functions: as a substrate for mounting components, as a heat dissipation structure, and as a support for the metal pattern layer, thereby improving reliability without significantly complicating the manufacturing process
3Ease of manufacture
If traditional packaging structures are used, then manufacturing cost is low, but heat dissipation efficiency and package density increase is hindered
Solution Approach 1:
The patent optimizes the thickness parameter of the metal member to be greater than the electronic component thickness, and adjusts the layout parameters to enable direct mounting of components on the metal plate, achieving high package density while maintaining cost-effectiveness through simplified structure
Solution Approach 2:
The patent segments the packaging structure into distinct functional layers (metal plate, metal pattern layer, sealing resin layer, insulating layer), allowing for optimized heat dissipation paths and higher component density while keeping each layer relatively simple and cost-effective to manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables desirable heat dissipation characteristics, high package density, and cost-effective manufacturing with improved reliability of solder connections, as the metal-plating pattern layer facilitates efficient heat dissipation and uniform solder melting during reflow soldering.
Implementation Method 1
the at least one metal member has a thickness greater than a thickness of the electronic component... desirable heat dissipation characteristics
Implementation Method 2
the metal-plating pattern layer facilitates efficient heat dissipation and uniform solder melting during reflow soldering
Data Source
AI summary
An electronic component package according to one aspect of the present disclosure includes a metal pattern layer having a first principal surface and a second principal surface, an electronic component disposed on the first principal surface and electrically connected to the metal pattern layer, at least one metal member disposed on the first principal surface and electrically connected to the metal pattern layer, a sealing resin layer disposed on the first principal surface, the electronic component and the at least one metal member, and an insulating layer disposed on the second principal surface. The at least one metal member is thicker than the electronic component. In plan view, the at least one metal member is disposed on an area of the first principal surface, the area including an end of the first principal surface. The at least a part of the metal pattern layer is exposed from the insulating layer.