Substrate-Level MEMS Assembly for Miniaturization
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Solution Overview
Problem
Traditional packaging techniques for MEMS sensors are bulky and costly, making them unsuitable for size minimization and cost optimization in applications like automotive and consumer electronics, where size reduction and manufacturing efficiency are crucial.
Innovation Solution
A substrate-level assembly is developed, where a capping substrate is bonded to a device substrate using a bonding region, creating a sensor cavity and access ducts to allow for fluid interaction with the sensor membrane while maintaining electrical connectivity through vias or connection pads, enabling miniaturization and cost-effective manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional packaging techniques are used for MEMS sensors, then the sensors are protected and functional, but the dimensions and manufacturing costs increase
Solution Approach 1:
The patent merges the sensor substrate with the package substrate into a single integrated structure. The sensor is formed directly on the package substrate, eliminating the need for separate packaging steps and reducing the overall device volume while maintaining protection and functionality
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it acts as the structural package, the sensor substrate, and the mounting substrate for electrical connections. This multi-functionality reduces the number of separate components needed, thereby reducing device dimensions and manufacturing complexity
2Volume of moving object
If traditional packaging techniques are used for MEMS sensors, then the sensors are protected and functional, but the device complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated substrate structure. The package substrate simultaneously provides mechanical support, sensor functionality, and electrical connection pathways, thereby reducing device complexity while enabling miniaturization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate-level assembly significantly reduces the dimensions and manufacturing costs of MEMS devices, providing effective protection and fluid isolation, while allowing for easy handling and integration with compact packages, such as LGA or BGA types.
Implementation Method 1
a capping substrate is bonded to a device substrate using a bonding region
Data Source
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Figure 9~11
AI summary
In a substrate-level assembly (22), a device substrate (20) of semiconductor material has a top face (20a) and houses a first integrated device (1; 16), in particular provided with a buried cavity (3), formed within the device substrate (20), and with a membrane (4), suspended over the buried cavity (3) in the proximity of the top face (20a). A capping substrate (21) is coupled to the device substrate (20) above the top face (20a) so as to cover the first integrated device (1; 16), in such a manner that a first empty space (25) is provided above the membrane (4). Electrical-contact elements (28a, 28b) electrically connect the integrated device (1; 16) with the outside of the substrate-level assembly (22). In one embodiment, the device substrate (20) integrates at least a further integrated device (1', 10) provided with a respective membrane (4'); and a further empty space (25'), fluidically isolated from the first empty space (25), is provided over the respective membrane (4') of the further integrated device (1', 10).