Substrate Liquid Circulation Control for Stable Chamber Flow
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Solution Overview
Problem
Existing substrate treatment processes face challenges in maintaining a constant flow rate of liquid to the substrate, leading to damage from excessive flow and inadequate cleaning from insufficient flow, while also risking damage to constant pressure valves and introducing particles into the chamber.
Innovation Solution
A substrate treating apparatus and method that utilize a circulation line with a pump and electro-pneumatic regulators to maintain a constant flow rate by adjusting the upstream and downstream flow rates based on a distribution flow rate, preventing damage to constant pressure valves and ensuring efficient cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a constant pressure valve is used to maintain flow rate, then the flow rate to substrate is stabilized, but the valve is damaged by high pressure and generates particles
Solution Approach 1:
The patent removes the constant pressure valve from the liquid supply path and replaces it with a circulation system using a pump and flow rate controller. This extraction eliminates the source of particle contamination while maintaining flow rate stability through alternative means.
Solution Approach 2:
The patent replaces the mechanical constant pressure valve with an electro-pneumatic regulator and pump-based circulation system. This substitution uses electrical and pneumatic control mechanisms instead of purely mechanical pressure regulation, avoiding the damage and particle generation issues of the valve.
2Productivity
If liquid flow rate is increased to improve cleaning efficiency, then impurity removal is enhanced, but thin films and patterns on substrate are damaged
Solution Approach 1:
The patent implements a feedback control system where a flow rate controller continuously monitors and adjusts the liquid flow rate to maintain it at a predetermined level. This ensures optimal cleaning efficiency while preventing excessive flow that would damage thin films and patterns.
Solution Approach 2:
The patent uses a circulation system with variable speed pump control that dynamically adjusts flow rates based on process requirements. This allows the system to maintain precise flow control, providing sufficient cleaning power when needed while preventing damage through controlled flow limitations.
3Manufacturing precision
If liquid flow rate is decreased to prevent substrate damage, then pattern integrity is maintained, but impurity removal becomes insufficient
Solution Approach 1:
The feedback control system ensures the flow rate remains at the optimal predetermined level, preventing it from dropping to insufficient levels. This maintains both pattern integrity and effective impurity removal by keeping the flow rate within the safe and effective range.
Solution Approach 2:
The circulation system provides continuous liquid flow to the substrate, ensuring consistent cleaning action. The pump maintains uninterrupted circulation at controlled rates, preventing periods of insufficient flow that would allow impurities to accumulate while avoiding excessive flow that would cause damage.
4Productivity
If the number of chambers supplied with liquid is increased, then processing capacity is improved, but maintaining constant flow rate to each chamber becomes difficult
Solution Approach 1:
The patent divides the liquid supply system into separate circulation lines for each chamber, with individual flow rate controllers on each line. This segmentation allows each chamber to receive independently controlled liquid flow, maintaining constant flow rates even when multiple chambers are operating simultaneously.
Solution Approach 2:
The patent uses a centralized pump system that can serve multiple chambers through a distribution network. The single pump provides liquid to all chambers, and the flow rate controller distributes appropriate flow rates to each chamber, allowing the system to maintain flow consistency across multiple chambers while improving processing capacity.
Data Source
AI summary
Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.