Substrate Liquid Receiving Structure for Electrostatic Drainage

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in smoothly discharging treatment liquids scattered from substrates during processing, which can lead to retention of liquids and affect subsequent processing steps.

Innovation Solution

The substrate processing apparatus includes a holder for the substrate, a supply nozzle for the treatment liquid, a rotation driver for substrate rotation, a receiving portion with an electrode and insulator to manage liquid movement, and a voltage controller to apply controlled voltages to the electrode, promoting the downward movement of treatment liquids through a combination of voltage application and wettability gradients.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a receiving portion is used to collect scattered treatment liquid, then liquid collection is improved, but liquid retention in the receiving portion occurs

Engineering Contradiction:

Improvetreatment liquid collectionVSAvoidliquid discharge smoothness

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The patent replaces mechanical liquid discharge methods with an electrostatic field-based system. An electrode generates an electrostatic field that interacts with charged treatment liquid particles, causing them to move along the inner wall of the receiving portion and be discharged smoothly without mechanical intervention, thus preventing liquid retention.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical state and properties of the treatment liquid by charging it with ions before it enters the receiving portion. This parameter change (from neutral to charged) enables the liquid to interact with the electrostatic field generated by the electrode, fundamentally altering its discharge behavior and preventing retention.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If treatment liquid is supplied to substrate and then scattered, then substrate processing is achieved, but liquid may re-adhere to substrate affecting subsequent processing

Engineering Contradiction:

Improveprocessing efficiencyVSAvoidliquid re-adhesion

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent uses an electrostatic field to control liquid behavior instead of relying on gravity or mechanical wiping. The electrostatic force actively directs charged liquid particles away from the substrate and along the receiving portion wall, preventing re-adhesion and ensuring clean substrate surfaces for subsequent processing.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces charged ions as an intermediary between the treatment liquid and the electrostatic field. These ions charge the liquid particles, enabling them to respond to the electrostatic field generated by the electrode, which then controls their movement and prevents harmful re-adhesion to the substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents the retention of treatment liquids in the receiving portion, reducing the risk of re-adhesion to the substrate and ensuring smooth processing by promoting the efficient downward movement of liquids.

Implementation Method 1

an electrode (25) provided on an inner circumferential surface of the receiving portion (24) and configured to receive the treatment liquid

Methodology Applied

Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 2

an insulator (26) covering an electrode surface of the electrode (25)

Methodology Applied

Scientific EffectWettability gradient: Wetting

Data Source

PatentUS20250069909A1Substrate processing apparatus, substrate processing method, and semiconductor device manufacturing method

Publication Date: 2025.02.27 KIOXIA CORP

AI summary

A substrate processing apparatus includes a holder configured to hold a substrate; a supply nozzle configured to provide a treatment liquid to the substrate; a rotation driver configured to rotate the substrate; a receiving portion configured to receive the treatment liquid scattered from the substrate; an electrode provided on a surface of the receiving portion and configured to receive the treatment liquid; an insulator covering an electrode surface of the electrode; and a voltage controller configured to control a voltage to be applied to the electrode.