Substrate Processing Liquid Film Transition

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Solution Overview

Problem

In existing substrate processing methods, the front surface of substrates is exposed during the transition from chemical liquid treatment to rinsing, risking particle adherence and contamination, as the method of Patent Document 1 fails to maintain continuous liquid coverage, leading to potential particle adherence and incomplete rinsing.

Innovation Solution

A substrate processing method that maintains a liquid film on the substrate's surface throughout the chemical liquid treatment and rinsing process by transitioning from a chemical liquid puddle step to a puddle rinse step without exposing the surface, using a chemical liquid puddle step to hold a chemical liquid film and then replacing it with a rinse liquid film, ensuring continuous coverage and preventing particle adherence.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the substrate rotation speed is decreased to zero or low speed during rinsing to form a puddled liquid film, then the liquid film can be held on the substrate surface without flowing off, but the transition from chemical liquid treatment to rinsing exposes the substrate surface, causing particle adherence and contamination

Engineering Contradiction:
Improveliquid film stabilityVSAvoidparticle adherence
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The substrate rotation speed is decreased to zero or low speed before the chemical liquid treatment is completely finished, so that the rinsing liquid film can be formed and held on the substrate surface in advance. This preliminary action ensures continuous liquid coverage during the transition from chemical liquid treatment to rinsing, preventing the substrate surface from being exposed and avoiding particle adherence.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If the substrate rotates at high speed during chemical liquid treatment, then the chemical liquid spreads uniformly across the substrate surface, but the liquid flows off quickly, making it difficult to maintain a stable liquid film for thorough treatment

Engineering Contradiction:
Improvechemical treatment uniformityVSAvoidliquid film retention time
Core Design Contradiction:
Manufacturing precisionVSDuration of action of stationary object

Solution Approach 1:

The substrate rotation speed is dynamically adjusted during the processing sequence. During chemical liquid treatment, the substrate rotates at high speed to spread the chemical liquid uniformly. When transitioning to rinsing, the rotation speed is decreased to zero or low speed to hold the rinsing liquid film on the substrate surface. This dynamic adjustment of rotation speed allows both uniform chemical treatment and stable liquid film retention.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method ensures the substrate's surface remains covered throughout the process, preventing particle adherence and ensuring thorough rinsing, thereby improving cleanliness and maintaining in-plane uniformity of chemical treatment rates across the substrate.

Implementation Method 1

a substrate holding unit that holds a substrate in a horizontal posture

Methodology Applied
Scientific EffectGravity: Gravitation

Implementation Method 2

a state in which the liquid stagnates on the front surface of the substrate because of surface tension so as to form a liquid film

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Data Source

PatentUS10312114B2Substrate processing method, and substrate processing device
Publication Date: 2019.06.04 SCREEN HOLDINGS CO LTD
  • US10312114B2 patent drawing
  • US10312114B2 patent drawing
  • US10312114B2 patent drawing

AI summary

This substrate processing method includes supplying a chemical liquid to an upper surface of a substrate and rinsing away the chemical liquid adhering to the upper surface of the substrate by holding a puddled rinse liquid on the substrate while maintaining a rotation speed of the substrate at a zero or low speed, and a chemical liquid puddle step of holding a liquid film of a puddled chemical liquid on the upper surface of the substrate while maintaining the rotation speed of the substrate at a zero or low speed, and the rinsing step is performed subsequent to finishing the chemical liquid puddle step, and the rinsing step includes supplying a rinse liquid to the upper surface of the substrate and then replacing the liquid film of the chemical liquid held on the upper surface of the substrate with the rinse liquid.