Substrate Treating Liquid for Sublimation Drying of Fine Patterns
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Solution Overview
Problem
Existing substrate drying methods face challenges in preventing pattern collapse during the drying process, especially on substrates with fine patterns and high aspect ratios, due to surface tension and mechanical strength issues.
Innovation Solution
A substrate treating liquid containing cyclohexanone oxime as a sublimable substance and a solvent such as alcohols, ketones, or ethers is used to prevent pattern collapse by employing sublimation drying, which inhibits the collapse of patterns on both hydrophobic and hydrophilic surfaces with high aspect ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional drying methods are used, then drying speed is improved, but pattern collapse occurs due to surface tension
Solution Approach 1:
The patent employs sublimation drying where the substrate treating liquid transitions from liquid to gas phase through sublimation of the solidified substance, avoiding the liquid-gas phase transition that causes surface tension. The process involves supplying substrate treating liquid containing a sublimable substance, solidifying it on the substrate surface, and then removing it through sublimation heating, thereby preventing pattern collapse while achieving efficient drying.
2Manufacturing precision
If sublimation drying is used, then pattern collapse is prevented, but additional process steps are required
Solution Approach 1:
The patent combines multiple functions into a single substrate treating liquid: the liquid serves as both the drying agent and the sublimable substance carrier. By incorporating a sublimable substance into the substrate treating liquid, the solution achieves both effective liquid replacement and pattern protection in one integrated system, reducing the need for separate process steps.
3Productivity
If high rotation speed is used, then drying efficiency is improved, but local pattern collapse occurs in low mechanical strength regions
Solution Approach 1:
The patent uses sublimation drying where the substrate treating liquid is solidified and then removed through phase transition from solid to gas, avoiding the mechanical stress of high-speed rotation. The sublimation process occurs through heating that provides latent heat of sublimation, enabling gentle removal of the treating liquid without subjecting weak patterns to centrifugal forces that cause local collapse.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces pattern collapse rates, even in partial or local regions, by using cyclohexanone oxime in a concentration range of 0.1% to 10% within the substrate treating liquid, ensuring uniform solubility and effective drying without coolant requirements.
Implementation Method 1
a solution of a sublimable substance is supplied onto a substrate and the inside of recesses of the pattern is filled with the solution, followed by drying of a solvent in the solution. Subsequently, the inside of recesses of the pattern is filled with the sublimable substance in a solid state and the temperature of the substrate is raised to the temperature higher than a sublimation temperature of the sublimable substance to remove the sublimable substance from the substrate
Implementation Method 2
a substrate treating liquid capable of removing a liquid adhered to the surface of a substrate while preventing partial or local collapse of a pattern formed on the surface of the substrate. In order to solve the above-mentioned problems, the substrate treating liquid according to the present invention is a substrate treating liquid which is used for removing a liquid on a substrate having a pattern-formed surface, comprises cyclohexanone oxime as a sublimable substance, and at least one solvent selected from the group consisting of alcohols, ketones, ethers, cycloalkanes and water
Data Source
AI summary
The substrate treating liquid according to the present invention can be used for removing a liquid on a substrate such as a semiconductor substrate having a pattern-formed surface, and is characterized by including cyclohexanone oxime as a sublimable substance, and at least one solvent selected from the group consisting of alcohols, ketones, ethers, cycloalkanes and water.