Substrate Liquid Substitution to Prevent Center Particle Generation
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Solution Overview
Problem
Existing substrate processing methods generate particles at or near the center position of the substrate surface due to interruptions in the liquid film when nozzles are replaced, primarily caused by residue adhesion from liquid film interruptions.
Innovation Solution
A method involving shifting the supply position of processing liquids to eccentric positions, reducing flow rates, and adjusting rotation speeds to prevent liquid film interruptions and residue adhesion, using a substrate processing apparatus with controlled nozzle movements and flow rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the supply position of processing liquid is shifted to eccentric positions and flow rate is reduced during transition, then particle generation at center position is suppressed, but the device complexity increases due to coordinated control of multiple nozzle movements and flow rate adjustments
Solution Approach 1:
The supply position of the processing liquid is shifted to an eccentric position in advance before the substitute liquid supply position reaches the center, and the flow rate is reduced preliminarily during the transition. This preliminary action ensures that when the substitute liquid reaches the center, the processing liquid supply is already minimized, preventing particle generation without requiring complex real-time coordination
Solution Approach 2:
The liquid film continuity is maintained throughout the substitution process by coordinating the eccentric position shifting and flow rate reduction. The processing liquid continues to be supplied at a reduced flow rate from the eccentric position until the substitute liquid fully covers the center, ensuring continuous liquid film coverage and preventing residue adhesion
2Object-generated harmful factors
If the flow rate of processing liquid is reduced during position transition, then liquid splashing is suppressed, but the manufacturing precision may be affected due to extended substitution time
Solution Approach 1:
The flow rate reduction is performed preliminarily and progressively during the position transition, rather than abruptly. This gradual reduction suppresses liquid splashing while maintaining sufficient flow rate to prevent liquid film interruption, thereby avoiding residue adhesion and maintaining manufacturing precision
Solution Approach 2:
The flow rate parameter is dynamically changed during the substitution process. By reducing the flow rate from its initial value to a lower value during the position transition, the system suppresses liquid splashing while maintaining continuous liquid film coverage, balancing harm suppression with processing quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Suppresses particle generation at the substrate center by maintaining continuous liquid film transitions, reducing liquid splashing, and ensuring complete liquid substitution without residue adhesion.
Implementation Method 1
a substrate processing apparatus that supplies a processing liquid to a center position of a substrate surface of a rotating substrate, shifts a supply position of the processing liquid from the center position to a first eccentric position
Data Source
AI summary
A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.