Substrate Processing Liquid Switching for Oxidizing Strength and Drainage

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Solution Overview

Problem

Existing substrate processing methods using electrolyzed sulfuric acid face inefficiencies due to issues with oxidizing strength and etching rate, leading to decreased processing efficiency.

Innovation Solution

A substrate processing apparatus and method that allows for the selective use of electrolyzed sulfuric acid or sulfuric acid, with a valve mechanism to switch between modes, incorporating a supply tank, generator, recovery part, and circulation system to optimize processing conditions, and includes a mixing part and heater to adjust temperature and composition of the processing liquid.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If electrolyzed sulfuric acid is used as processing liquid, then drainage is reduced, but oxidizing strength and etching rate are insufficient

Engineering Contradiction:
ImprovedrainageVSAvoidoxidizing strength
Core Design Contradiction:
Loss of substanceVSReliability

Solution Approach 1:

The system dynamically switches between two processing liquids (electrolyzed sulfuric acid and conventional sulfuric acid) based on process requirements. The valve mechanism enables flexible selection of processing liquid type, allowing optimization of both drainage reduction and processing effectiveness for different substrate treatment needs

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes the chemical parameters of the processing liquid by selecting between electrolyzed sulfuric acid (lower oxidizing strength, reduced drainage) and conventional sulfuric acid (higher oxidizing strength, higher drainage). This parameter change allows matching the processing liquid properties to specific process requirements

Inventive Principle:
Principle #35Parameter changes

2Loss of substance

If electrolyzed sulfuric acid is used as processing liquid, then drainage is reduced, but etching rate decreases

Engineering Contradiction:
ImprovedrainageVSAvoidetching rate
Core Design Contradiction:
Loss of substanceVSProductivity

Solution Approach 1:

The system dynamically selects between processing liquids based on whether the priority is drainage reduction or etching rate. The valve mechanism enables real-time switching to optimize productivity when high etching rate is required, while maintaining drainage reduction benefits when using electrolyzed sulfuric acid

Inventive Principle:
Principle #15Dynamics

3Reliability

If conventional sulfuric acid is used, then oxidizing strength and etching rate are sufficient, but drainage increases

Engineering Contradiction:
Improveoxidizing strengthVSAvoiddrainage
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The system changes the chemical parameters of the processing liquid to match process requirements. When high oxidizing strength is needed, conventional sulfuric acid is selected; when drainage reduction is prioritized, electrolyzed sulfuric acid is used. This parameter adaptation resolves the contradiction between effectiveness and environmental impact

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and appropriate processing of substrates by allowing the selection of the right processing liquid, enhancing processing efficiency and flexibility.

Implementation Method 1

a generator that generates the first processing liquid through electrolysis

Methodology Applied
Scientific EffectElectrolysis: Electrolysis

Data Source

PatentEP4661056A1Substrate processing apparatus and substrate processing method
Publication Date: 2025.12.10 SCREEN HOLDINGS CO LTD
  • EP4661056A1 patent drawingFigure 1
  • EP4661056A1 patent drawingFigure 2~3
  • EP4661056A1 patent drawingFigure 4

AI summary

Various processes on substrates are efficiently performed. A substrate processing apparatus includes: a first valve disposed in a first pipe for supplying a supply tank with a first processing liquid; a second valve disposed in a second pipe to allow a generator to recover the first processing liquid from a substrate processing part; a third valve disposed in a third pipe for supplying the supply tank with a second processing liquid from a supply source; and a fourth valve disposed in a fourth pipe for circulating the second processing liquid through the supply tank, wherein in the first mode, the first valve and the second valve are opened, and the third valve and the fourth valve are closed, and in the second mode, the third valve and the fourth valve are opened, and the first valve and the second valve are closed.