Load Lock Camera Inspection for Substrate Defects and Transfer Accuracy
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Solution Overview
Problem
Current inspection systems for film deposition processes on glass and wafer substrates are inadequate in detecting defects and evaluating process parameters, such as substrate location, fixture status, electrode sagging, and transfer robot performance, leading to limitations in monitoring the deposition process effectively.
Innovation Solution
A camera-based inspection system that captures images of the substrate at various stages during the film deposition process, using multiple cameras positioned in the load lock chamber to analyze edge lines, reflectiveness, refractiveness, and film corner profiles to evaluate the deposition process and detect defects, and a control unit to display analysis results and images, ensuring accurate loading and transfer operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a camera-based inspection system is implemented to detect defects and evaluate process parameters, then measurement precision and manufacturing precision are improved, but device complexity increases due to multiple cameras and controllers
Solution Approach 1:
The camera-based inspection system is designed to perform multiple functions simultaneously: detecting substrate defects, evaluating film deposition quality, assessing robot transfer accuracy, and monitoring process parameters. By consolidating these inspection functions into a single integrated system using multiple cameras and a controller, the patent improves measurement precision across all parameters while managing device complexity through unified multi-functional architecture
Solution Approach 2:
The inspection system divides the substrate inspection into multiple stages (before deposition, during deposition, after deposition) and uses multiple cameras positioned at different locations to capture images of different regions. This segmentation approach allows comprehensive defect detection and process evaluation while organizing the complex system into manageable modular components
2Measurement precision
If multiple cameras are used to capture images at multiple stages, then measurement precision and comprehensive inspection are improved, but loss of time increases due to multiple capture cycles
Solution Approach 1:
The inspection system operates continuously throughout the film deposition process rather than performing separate inspection cycles. Cameras capture images at multiple stages (before deposition, during deposition, after deposition) without interrupting the continuous manufacturing flow, allowing comprehensive process parameter evaluation while minimizing time loss through seamless integrated inspection
Solution Approach 2:
The system captures baseline images of the substrate before film deposition begins, establishing reference data for subsequent comparison. This preliminary inspection action allows the system to pre-identify substrate defects and set measurement baselines, improving overall measurement precision while optimizing the timing of inspection activities to reduce total inspection time
Data Source
AI summary
This application relates to a method of inspection and an inspection system for the film deposition process for substrates that includes glass and wafer. The inspection system includes multiple camera modules positioned in a load lock unit of a process chamber, such as the camera modules that can capture images of the substrate in the load lock. The images are analyzed by a control unit of the inspection system to determine the accuracy of robots in handling the substrate, calibration of the robots based on the analysis, and defects in the substrate caused during the handling and deposition process.


