Substrate Loading Sequence Control to Minimize CMP Idling
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Solution Overview
Problem
Conventional substrate processing apparatuses face inefficiencies in reducing the total processing time due to fixed loading orders, leading to substrate idling states that can cause instability and corrosion, particularly when processing copper substrates.
Innovation Solution
A substrate processing apparatus with a control device that calculates and optimizes the loading order and generates a time table to minimize idling, associating process end times across polishing, cleaning, and transport units, allowing for dynamic adjustment of substrate routes and device replacements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a fixed loading order is used for substrates in the substrate processing apparatus, then the control system is simple and easy to operate, but the total processing time is extended due to substrate idling states
Solution Approach 1:
The patent implements dynamic substrate loading order optimization by calculating multiple possible loading patterns and selecting the optimal sequence that minimizes total processing time. The control device dynamically adjusts the loading order based on real-time substrate characteristics and processing requirements, transitioning from a fixed static schedule to a dynamic adaptive scheduling system.
Solution Approach 2:
The system changes the parameter of loading order from a fixed constant to a variable that can be optimized. By calculating different loading patterns and selecting the one with the shortest total processing time, the system dynamically adjusts this parameter based on substrate characteristics, processing recipes, and device availability.
2Device complexity
If substrates are processed in a fixed sequence, then the processing workflow is simple to manage, but substrate idling states occur causing instability and corrosion
Solution Approach 1:
The system performs preliminary calculation of optimal loading patterns before actual substrate processing begins. By pre-calculating the best loading sequence that minimizes idling time and ensures continuous processing, the system prepares an optimized workflow schedule in advance, eliminating substrate wait times and associated stability issues.
Solution Approach 2:
The control device incorporates feedback mechanisms that monitor substrate processing status, device availability, and timing information. This feedback is used to dynamically adjust and optimize the loading sequence, ensuring that substrates are continuously processed without idle states that would cause corrosion or instability.
3Productivity
If the loading order is optimized to reduce total processing time, then productivity increases, but the calculation and control complexity increases
Solution Approach 1:
The patent segments the substrate processing problem into discrete calculable units by dividing substrates into groups based on their processing characteristics and requirements. This segmentation allows the control device to calculate optimal loading patterns for different substrate groups independently, then combine them into an overall optimized schedule, making the complex calculation manageable.
Data Source
AI summary
A control device of a substrate processing apparatus is configured to execute: calculating patterns for changing an order of loading to the substrate processing apparatus for multiple substrates loaded to the substrate processing apparatus; generating, for each obtained pattern, a time table in which process end times in the polishing device, the cleaning device, and the transport device are associated, so that an idling state does not occur from a time when the substrates are loaded to the substrate processing apparatus until a cleaning process ends; selecting a time table with a shortest time from a time when a process of a substrate initially loaded to the substrate processing apparatus starts until a process of a lastly loaded substrate ends in the obtained time tables; and controlling timings of loading the substrates to the substrate processing apparatus based on the selected time table.