Substrate Loading Table Temperature Control for Semiconductor Processing
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Solution Overview
Problem
Current substrate processing technologies face challenges in performing multiple processes at different temperatures within a single chamber efficiently, as existing apparatuses are not designed for continuous operation at varying temperatures, leading to reduced throughput in semiconductor manufacturing.
Innovation Solution
A substrate processing apparatus with a temperature adjusting mechanism that allows for continuous processing at different temperatures by using a substrate loading table with a temperature adjusting medium passage, a heater, and an extraction mechanism to rapidly change the substrate temperature, enabling processes at both low and high temperatures within a single vacuum chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple processes at different temperatures are performed in separate chambers, then temperature control for each process is maintained, but processing time increases and throughput decreases
Solution Approach 1:
The patent combines multiple process chambers into a single integrated chamber that can accommodate both low-temperature and high-temperature processes simultaneously. The substrate loading table includes both a temperature adjusting medium passage (for cooling) and a heater (for heating), allowing the same chamber to maintain different temperature zones or switch between temperature regimes without requiring separate chambers, thereby reducing transfer time and improving throughput.
Solution Approach 2:
The system dynamically switches between temperature adjusting modes by controlling the flow of temperature adjusting medium through the passage and activating/deactivating the heater as needed. This dynamic temperature control allows the chamber to adapt to different process requirements in sequence or simultaneously, maintaining optimal temperature for each process step without fixed chamber temperature limitations.
2Productivity
If a single chamber is used for multiple processes at different temperatures, then throughput increases, but temperature control complexity increases
Solution Approach 1:
The substrate loading table is designed with multi-functionality, serving both as a substrate support and as an integrated temperature control unit. It incorporates both the temperature adjusting medium passage (for cooling) and the heater (for heating), allowing a single component to perform multiple temperature control functions. This universal design reduces the need for separate temperature control systems for different process types, managing complexity while enabling high throughput.
Solution Approach 2:
The patent applies different temperature control mechanisms to different regions or aspects of the substrate processing. The temperature adjusting medium passage provides cooling capability in certain areas, while the heater provides heating in other areas or at different times. This localized application of different temperature control qualities allows the single chamber to handle diverse temperature requirements without requiring a completely complex unified system.
3Productivity
If temperature is changed rapidly between processes, then processing efficiency improves, but temperature stability during each process deteriorates
Solution Approach 1:
The system maintains continuous temperature control capability throughout the processing cycle. The temperature adjusting medium can flow continuously through the passage while the heater can provide continuous heating when needed. This continuous action ensures that temperature transitions are smooth and that temperature stability is maintained during each process step, preventing thermal shock or instability while still enabling rapid transitions between different temperature processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-throughput processing by allowing multiple processes to be performed at different temperatures in a single chamber, enhancing efficiency and reducing processing time, which is critical for complex semiconductor manufacturing applications.
Implementation Method 1
a temperature adjusting medium passage which is installed in the substrate loading table and through which a temperature adjusting medium for adjusting a temperature of the target substrate loaded on the substrate loading table flows
Implementation Method 2
a heater installed at a position closer to the loading surface than the temperature adjusting medium passage of the substrate loading table
Data Source
AI summary
A substrate processing apparatus includes a process container; a process gas supply mechanism; a substrate loading table; a temperature adjusting medium passage; a temperature adjusting medium extraction mechanism; a heater; and a temperature controller. The temperature controller is configured to adjust a temperature of a target substrate to a first temperature by allowing a temperature adjusting medium to flow through the temperature adjusting medium passage of the substrate loading table; and adjust the temperature of the target substrate to a second temperature higher than the first temperature by extracting the temperature adjusting medium of the temperature adjusting medium passage using the temperature adjusting medium extraction mechanism while heating the target substrate using the heater.