Electronic Component Built-in Substrate Localized Protection
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Solution Overview
Problem
Existing electronic component built-in substrates face challenges in miniaturization and reliability due to exposure of bonding wires and pads to external forces and corrosive cleaning agents, which can lead to deformation, breaking, and corrosion, hindering the miniaturization and reliability of electrical connections.
Innovation Solution
The solution involves coating the connection portion between the electronic component's electrode and bonding wire with a protection material, using core-contained solder balls for reliable electrical connections, and minimizing the coated area to reduce substrate thickness and planar dimensions, while ensuring the reliability of the electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connection portion between electrode and bonding wire is coated with protection material, then reliability of electrical connection is improved and bonding wire is protected from corrosion and deformation, but planar dimension and height dimension of substrate increase
Solution Approach 1:
The protection material is applied selectively only to the connection portion between the electrode and bonding wire, rather than coating the entire bonding wire or electrode structure. This localized coating approach provides corrosion and deformation protection exactly where needed while minimizing the added dimensions and maintaining substrate miniaturization.
Solution Approach 2:
Instead of providing complete coverage of the bonding wire and electrode assembly, the protection material is applied partially only to the critical connection portion. This partial action suffices to protect the most vulnerable area (the connection interface) without the dimensional penalty of full coverage.
2Ease of manufacture
If bonding wires and pads are exposed to external environment, then manufacturing process is simplified, but bonding wires are vulnerable to deformation and breaking, and pads are vulnerable to corrosion
Solution Approach 1:
The protection material is applied to the connection portion before the substrate undergoes subsequent manufacturing steps or usage. This preliminary protective action prevents corrosion and deformation during cleaning steps, assembly processes, and service life, while still allowing the manufacturing process to remain relatively simple compared to full encapsulation approaches.
3Reliability
If entire electronic component is transfer-molded with resin, then connection portion reliability is improved, but clearance between upper and lower boards increases, hindering miniaturization
Solution Approach 1:
Rather than applying protection material to the entire electronic component or using full transfer-molding of the component, the invention applies the protection material locally only to the connection portion between electrode and bonding wire. This localized approach provides necessary protection while minimizing impact on board clearance and maintaining miniaturization goals.
Solution Approach 2:
The invention extracts and protects only the critical connection portion from the broader electronic component structure. By isolating and protecting just the vulnerable connection interface rather than the entire component, the solution achieves reliability improvement without the dimensional penalties of comprehensive encapsulation.
Data Source
AI summary
An electronic component is provided between at least two wiring boards. An electrode of the electronic component is electrically connected to at least one of the wiring boards. Also, the wiring boards and are electrically connected to each other. Additionally, the gap between the wiring boards and is sealed with a resin. The electronic component built-in substrate is featured in that a bonding pad formed on one of the wiring boards and is electrically connected to an electrode of the electronic component by a bonding wire, and that at least a connection portion between the electrode of the electronic component and the bonding wire is coated with a protection material.