Substrate Lower Surface Liquid-Tight Processing
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Solution Overview
Problem
Existing substrate processing methods face challenges in efficiently performing processing liquid treatments on the lower surfaces of substrates, leading to excessive consumption of processing liquids and uneven treatment due to retained liquid films.
Innovation Solution
A substrate processing method involving a rotating substrate with a liquid-tight step where a processing liquid is discharged between the substrate and an opposed surface, forming a liquid-tight state with a small flow rate, and a releasing step where the liquid-tight state is instantaneously released to prevent further treatment, allowing for reduced liquid consumption and uniform treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a processing liquid is discharged to form a liquid-tight state between the substrate and opposed surface, then the processing liquid treatment is concentrated and effective, but a liquid film is retained on the lower surface of the substrate after the process time elapses causing continued treatment beyond the predetermined process amount
Solution Approach 1:
The opposed plate is made movable between a liquid-tight state (approximating the substrate during processing) and a separated state (after processing). This dynamic positioning allows the system to achieve concentrated processing liquid treatment when needed while preventing liquid film retention by separating the plate afterward, thus resolving the contradiction between treatment precision and liquid consumption.
Solution Approach 2:
The processing cycle alternates between a liquid-tight state where processing liquid is discharged for concentrated treatment, and a separated state where the opposed plate is moved away to release the liquid-tight condition. This periodic switching ensures effective treatment during the liquid-tight phase while preventing over-processing and excessive liquid consumption during the separated phase.
2Manufacturing precision
If the opposed plate is arranged in an approximate position to the lower surface of the substrate to achieve liquid-tight state, then processing liquid treatment is concentrated, but a liquid film is retained on the substrate surface after processing
Solution Approach 1:
The opposed plate transitions dynamically between approximating the substrate (for concentrated, uniform treatment) and separating from it (to release retained liquid film). This dynamic movement enables the system to achieve uniform treatment during the approximating phase while eliminating liquid film retention in the separating phase, thereby maintaining both treatment quality and processing efficiency.
3Manufacturing precision
If processing liquid is continuously supplied to maintain treatment, then the lower surface of the substrate is continuously treated, but the treatment exceeds the predetermined process amount leading to unfavorable processing
Solution Approach 1:
The system employs periodic action by alternating between a liquid-tight state (where processing liquid is supplied for controlled treatment) and a separated state (where liquid supply is stopped and the opposed plate is moved away). This periodic cycling ensures that processing liquid is supplied only during the liquid-tight phase for precise process amount control, while the separated phase prevents continuous treatment and reduces overall liquid consumption.
Solution Approach 2:
The system uses feedback control where the position of the opposed plate (approximating or separating from the substrate) regulates the supply and retention of processing liquid. When the plate approximates the substrate, liquid is supplied for treatment; when separated, liquid supply stops and retained liquid is released. This feedback mechanism precisely controls process amount and prevents excessive liquid usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces processing liquid consumption and ensures uniform treatment of the substrate's lower surface by controlling the liquid-tight state and release, preventing unnecessary treatment after the liquid-tight state is achieved.
Implementation Method 1
a processing liquid is discharged from a processing liquid dispense port of a lower surface nozzle opposed to the lower surface of the substrate to cause a space between the lower surface of the substrate and the first opposed surface to be in a liquid-tight state by the processing liquid
Data Source
AI summary
This substrate processing method includes: a substrate rotating step of rotating a substrate around a predetermined vertical axis line at a first rotation speed; a liquid-tight step performed along with the substrate rotating step, and where a first opposed surface is opposed at a first distance to a rotated lower surface of the substrate, and at the same time, a processing liquid is discharged from a processing liquid dispense port of a lower surface nozzle opposed to the lower surface of the substrate to cause a space between the lower surface and the first opposed surface to be in a liquid-tight state by the processing liquid; and a liquid-tight state releasing step of releasing the liquid-tight state in the space between the lower surface and the first opposed surface by separating the lower surface and the first opposed surface after the liquid-tight step.