Substrate Assembly Magnetic Feature for Voltage Regulator
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Solution Overview
Problem
Legacy fully integrated voltage regulators (FIVRs) in semiconductor devices are limited by the dielectric material surrounding the voltage regulator, which affects signal integrity and complicates manufacturing due to the use of magnetic film across the entire substrate assembly.
Innovation Solution
A substrate assembly design with a magnetic feature located on one side of the substrate, extending only over the area where the coil of the voltage regulator is located, using a ferromagnetic material with higher magnetic permeability than traditional magnetic films, and applying a magnetic paste to create the feature, which encapsulates the coil elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic film is applied across the full area of the substrate assembly, then the performance of the inductor is improved, but the signal integrity of high speed signals deteriorates and manufacturing difficulty increases
Solution Approach 1:
The magnetic feature is applied locally only at the second side of the base substrate where the coil is located, rather than across the full substrate area. This localized application maintains the inductor performance benefits while reducing the magnetic material's impact on high-speed signals traveling through other areas of the substrate assembly.
Solution Approach 2:
The substrate assembly is divided into regions with different magnetic properties: a first side without magnetic material for high-speed signal routing, and a second side with magnetic feature for inductor performance. This segmentation allows each region to optimize its function without compromising the other.
2Reliability
If magnetic film is applied across the full area of the substrate assembly, then the performance of the inductor is improved, but the manufacturing difficulty increases
Solution Approach 1:
The magnetic feature is applied locally only at the second side of the base substrate where the coil is located, rather than across the full substrate area. This localized application maintains the inductor performance benefits while reducing the magnetic material's impact on high-speed signals traveling through other areas of the substrate assembly.
Solution Approach 2:
The substrate assembly is divided into regions with different magnetic properties: a first side without magnetic material for high-speed signal routing, and a second side with magnetic feature for inductor performance. This segmentation allows each region to optimize its function without compromising the other.
3Reliability
If dielectric material surrounds the voltage regulator, then the voltage regulator is protected and integrated, but the signal integrity deteriorates and performance is limited
Solution Approach 1:
The magnetic feature is applied locally only at the second side of the base substrate where the coil is located, rather than across the full substrate area. This localized application maintains the inductor performance benefits while reducing the magnetic material's impact on high-speed signals traveling through other areas of the substrate assembly.
Solution Approach 2:
The magnetic feature acts as an intermediary element between the coil and the dielectric material, providing enhanced magnetic permeability where needed while allowing the dielectric material to maintain its protective and insulating functions in other areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the performance of the inductor associated with the voltage regulator by enhancing magnetic permeability, reducing signal integrity issues, and simplifying the manufacturing process by minimizing the impact of magnetic materials on high-speed signals.
Implementation Method 1
using a ferromagnetic material with higher magnetic permeability than traditional magnetic films
Implementation Method 2
applying a magnetic paste to create the feature, which encapsulates the coil elements
Data Source
AI summary
Apparatuses, systems and methods associated with substrate design with a magnetic feature for fully integrated voltage regulator are disclosed herein. In embodiments, a substrate assembly may include a base substrate and one or more interconnect elements located at a first side of the base substrate, the one or more interconnect elements to be coupled to a semiconductor chip having an integrated voltage regulator (IVR). The substrate assembly may further include a magnetic feature located at a second side of the base substrate, the second side being opposite to the first side, wherein the magnetic feature extends along a portion of the second side of the base substrate that is opposite to where the IVR is to be located when the semiconductor chip is coupled to the one or more interconnect elements. Other embodiments may be described and/or claimed.