Substrate Insulating Layer Layout for Clear Mark Reading

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Solution Overview

Problem

Conventional substrate structures face challenges in designing marks that do not interfere with circuit structures, leading to reduced wiring space and uneven surfaces, which affect mark reading quality.

Innovation Solution

A substrate structure comprising a substrate body with a dielectric and circuit layer, a first insulating layer exposing circuit layer portions, and a second insulating layer with a mark, allowing the mark to be positioned independently without interfering with the circuit layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a mark is printed on the same surface as the circuit layer, then the mark reading can be performed, but the wiring space of the circuit layer is reduced and the surface becomes uneven

Engineering Contradiction:
Improvemark reading qualityVSAvoidwiring space
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent applies dimensionality change by moving the mark from the same plane as the circuit layer to a different vertical level. Specifically, the mark is formed on the top surface of the substrate body, while the circuit layer is embedded within the substrate body at a lower level. This vertical separation resolves the contradiction by providing sufficient wiring space for the circuit layer while maintaining a clear, accessible surface for mark printing and reading.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Loss of information

If a mark is printed on the same surface as the circuit layer, then the mark can be placed on the substrate, but the circuit structure interferes with the mark reading

Engineering Contradiction:
Improvemark reading success rateVSAvoidcircuit structure interference
Core Design Contradiction:
Loss of informationVSObject-generated harmful factors

Solution Approach 1:

The patent applies segmentation by separating the mark-forming region from the circuit layer region. The substrate body is structured such that the circuit layer is embedded within it, while the mark is formed on the exposed top surface. This spatial segmentation ensures that the circuit structures do not interfere with the mark reading process, as they occupy different physical zones and functional layers of the substrate.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration maintains sufficient wiring space for the circuit layer and improves the success rate of mark reading by avoiding interference from the circuit structure.

Implementation Method 1

the recess is formed on the second insulating layer in a manner of laser ablation

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS20250133653A1Substrate structure and manufacturing method thereof
Publication Date: 2025.04.24 SILICONWARE PRECISION IND CO LTD
  • US20250133653A1 patent drawing
  • US20250133653A1 patent drawing
  • US20250133653A1 patent drawing

AI summary

A substrate structure and a manufacturing method thereof are provided, in which a substrate body including a dielectric layer and a circuit layer formed on the dielectric layer is provided with a first insulating layer thereon, and a second insulating layer is further provided on the first insulating layer, and a mark is arranged on the second insulating layer. In this way, the arrangement of the mark will not affect wiring space of the circuit layer of the substrate body, and it will not be interfered by the circuit layer when reading the mark, thereby improving the reading success rate.