Substrate Mask Aligning Apparatus Real-Time Correction
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Solution Overview
Problem
Existing substrate and mask aligning apparatuses face challenges in achieving precise alignment due to substrate and mask distortions, particularly when new substrates with varying shrinkage and distortion levels are used, and the application of tension during alignment, leading to unexpected deviations in pad positions.
Innovation Solution
A substrate and mask aligning apparatus that calculates and adjusts alignment data in real-time using image processing to align the substrate and mask positions accurately, employing a stage and mask moving mechanism, and multiple camera systems to capture and process images of the substrate and mask, allowing for precise alignment by calculating correction data based on actual superposed states.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If alignment is performed based on previously captured image data of substrate and mask, then alignment process is simplified, but alignment precision deteriorates due to substrate shrinkage, distortion, and mask tension variations
Solution Approach 1:
The patent applies preliminary action by capturing images of the substrate and mask before alignment, calculating their positions in advance, and pre-calculating movement data. This allows the alignment process to use pre-prepared data, simplifying the actual alignment operation while maintaining precision through real-time verification and correction based on the captured images.
Solution Approach 2:
The patent implements feedback by capturing images of the substrate and mask, calculating their actual positions, comparing them with target positions, and adjusting the alignment based on the calculated deviations. This closed-loop feedback mechanism ensures that alignment precision is maintained despite variations in substrate shrinkage, distortion, and mask tension by continuously monitoring and correcting positional deviations.
2Productivity
If mask is used continuously while new substrates with varying shrinkage and distortion levels are supplied, then production efficiency is improved, but alignment precision deteriorates due to accumulated deviations
Solution Approach 1:
For each new substrate, the system performs preliminary imaging and position calculation before alignment. This allows the system to adapt to each substrate's specific shrinkage and distortion characteristics individually, maintaining alignment precision even when using the same mask continuously across multiple substrates with varying properties.
Solution Approach 2:
The patent changes parameters by calculating movement data based on actual image data captured for each substrate-mask combination. This allows the system to adjust alignment parameters dynamically for each substrate, compensating for variations in shrinkage and distortion levels while maintaining consistent alignment precision across different substrates using the same mask.
3Ease of operation
If tension is applied to mask during superposition, then mask positioning is facilitated, but alignment precision deteriorates due to unexpected pad position deviations
Solution Approach 1:
The system captures images of the mask and substrate before applying tension during superposition. By calculating positions based on these pre-tension images, the system can compensate for the positional changes that occur when tension is applied, maintaining pad position accuracy while still facilitating easy mask positioning through the tension application.
Solution Approach 2:
The patent uses feedback by capturing images, calculating actual positions, and comparing them with target positions. This allows the system to detect and correct for position deviations caused by mask tension, ensuring that pad position accuracy is maintained even though tension is applied to facilitate mask positioning during superposition.
Data Source
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AI summary
A substrate and mask aligning apparatus includes a controlling portion 70 for calculating moving data that are applied to eliminate a difference between a present superposed state of the through holes 52 of the mask 50, which comes into contact with the substrate 20 that is loaded on the stage 30, on the pads 22 of the substrate 20 and a scheduled superposed state on the basis of image data from the shooting section 40, 42 and then executing repeatedly an operation to move the stage 30 on the basis of the calculated moving data of the stage.