Substrate Measurement Beam Alignment via Pattern Center Detection

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

As semiconductor devices become smaller, the accuracy of thin film thickness measurement on substrates is compromised due to reduced measurement areas, leading to potential measurement errors and decreased device quality.

Innovation Solution

A method involving the use of a measuring apparatus that irradiates a measurement beam onto an identifiable pattern on the substrate, detects the center position, calculates and adjusts the beam's position to align with the pattern's center, and then measures the thickness, ensuring accurate alignment and measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the measurement area is reduced to accommodate smaller semiconductor devices, then the device miniaturization is achieved, but the measurement accuracy deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoidthickness measurement accuracy

Core Design Contradiction:

Length of moving objectVSMeasurement precision

Solution Approach 1:

The patent applies preliminary action by detecting the center position of the measurement beam and the center position of the pattern before performing the thickness measurement. This allows the system to calculate the shift amount and correct the beam position in advance, ensuring accurate measurement even on miniaturized devices with limited measurement areas.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent implements feedback by detecting the actual position of the measurement beam on the substrate, comparing it with the intended target position, calculating the shift amount, and using this information to adjust the beam position. This closed-loop feedback mechanism ensures high measurement accuracy despite device miniaturization.

Inventive Principle:

Principle #23Feedback

2Manufacturing precision

If the design rule is made finer to achieve smaller device features, then the device integration is improved, but the measurement reliability deteriorates due to position deviation

Engineering Contradiction:

Improvedevice feature sizeVSAvoidmeasurement reliability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent uses feedback by continuously monitoring the measurement beam position, calculating the deviation from the target position, and adjusting the beam position based on the calculated shift amount. This ensures reliable measurements on fine-pitch devices where even minor position deviations can cause errors.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent replaces mechanical positioning methods with an optical-based detection and calculation system. By using optical detection to identify the measurement beam position and pattern center, and calculating the shift through coordinate analysis, the system achieves higher precision than traditional mechanical positioning methods.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Area of moving object

If the measurement area is reduced for smaller devices, then the device scale is improved, but the measurement accuracy deteriorates due to minute position deviations

Engineering Contradiction:

Improvemeasurement areaVSAvoidthickness measurement accuracy

Core Design Contradiction:

Area of moving objectVSMeasurement precision

Solution Approach 1:

The patent performs preliminary detection of the measurement beam center position and pattern center position before the actual thickness measurement. This allows the system to calculate the position shift and correct the beam alignment in advance, maximizing the use of the limited measurement area while maintaining high accuracy.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent employs optical detection and mathematical calculation to determine beam position and correct deviations, replacing less precise mechanical positioning methods. This substitution enables accurate measurements within reduced measurement areas by precisely tracking and correcting beam position through coordinate analysis.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the accuracy of thin film thickness measurement, reducing measurement errors and improving the reliability of semiconductor device manufacturing by ensuring precise alignment and measurement, even at smaller scales.

Implementation Method 1

irradiating a measurement beam into an identifiable pattern of the substrate, detecting a center position of the irradiated measurement beam

Methodology Applied

Scientific EffectLight reflection: Reflection

Data Source

PatentUS9716047B2Method of measuring a substrate and method of manufacturing a semiconductor device using the same

Publication Date: 2017.07.25 SAMSUNG ELECTRONICS CO LTD

AI summary

A method for measuring a substrate is provided. The method comprises irradiating a measurement beam into a site box of an identifiable pattern of a substrate, detecting a center position of the irradiated measurement beam, calculating an amount of shift of the center position of the measurement beam from the center position of the site box, and correcting the center position of the measurement beam to the center position of the site box by compensating the calculated amount of shift.