Substrate Manufacturing via Press-Fitted Metal Columns
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Solution Overview
Problem
Existing methods for manufacturing substrates with metal columns in insulating resin layers face challenges in reliability and cost due to the need for complex hole-forming and plating processes, limiting component mounting density and electrical connection reliability.
Innovation Solution
A method involving the formation of conductive bumps with metal fillers on metal foils, which are heated to form metallic bonds, then press-fitted into a thermosetting insulating resin layer before curing, and reheated to re-melt and strengthen the connections, eliminating the need for hole-forming and plating processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hole-forming processing and plating processing are used to form metal columns, then electrical connection reliability is improved, but manufacturing process complexity and cost increase
Solution Approach 1:
The invention extracts and eliminates the hole-forming processing and plating processing steps from the manufacturing process. Instead of creating holes and applying plating, the patent uses pre-formed conductor bumps that are directly press-fitted into the insulating resin layer, thereby removing complex processing steps while maintaining electrical connection functionality
Solution Approach 2:
The conductor bumps are prepared in advance with predetermined shapes and positions before being press-fitted into the insulating resin layer. This preliminary formation of conductive elements eliminates the need for subsequent hole-forming and plating operations, simplifying the overall manufacturing process while ensuring reliable electrical connections
2Reliability
If hole-forming processing and plating processing are used to form metal columns, then electrical connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The invention removes the costly hole-forming and plating processing steps from the manufacturing process by using pre-formed conductor bumps that can be directly press-fitted into the insulating resin, thereby reducing manufacturing costs while maintaining electrical connection reliability
Solution Approach 2:
The conductor bumps are used as disposable conductive elements that are press-fitted into the insulating resin and then cut off, eliminating the need for expensive plating materials and complex processing equipment, thereby reducing overall manufacturing costs
3Device complexity
If metal columns are formed by pressing bumps from both surfaces to crush tips, then manufacturing simplicity is improved, but electrical connection reliability deteriorates
Solution Approach 1:
The conductor bumps are prepared in advance with predetermined shapes, sizes, and positions before press-fitting. This preliminary preparation ensures proper alignment and contact with conductive patterns, improving electrical connection reliability while maintaining manufacturing simplicity
Solution Approach 2:
The invention changes the parameters of the conductor bumps, specifically using bumps with predetermined shapes and positions that are optimized for reliable electrical connection. The bumps are designed with appropriate dimensions and geometries to ensure good contact with conductive patterns after press-fitting, thereby improving reliability without complicating the manufacturing process
4Ease of manufacture
If conventional bump press-fitting is used, then manufacturing cost is reduced, but component mounting density is limited
Solution Approach 1:
The invention changes the parameters of the conductor bumps by providing them with predetermined shapes and positions that are optimized for high-density mounting. The bumps can be formed with precise dimensional control and positioning accuracy, enabling higher component mounting density while maintaining cost-effectiveness through the elimination of complex processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the reliability and cost-effectiveness of electrical connections by forming metallic bonds through diffusion in the solid layer, reducing the complexity and expense of substrate manufacturing while improving connection reliability.
Implementation Method 1
the bump is heated to a temperature lower than the curing temperature, at which the metal fillers are melted, to form the metal fillers bound to each other by melting, and form a metallic bond between the bump and the metal foil
Implementation Method 2
form the metal fillers bound to each other by melting, and form a metallic bond between the bump and the metal foil
Implementation Method 3
contact-bonded to a thermosetting insulating resin layer
Implementation Method 4
the metal columns are formed as the connecting conductors, which are obtained by electrically connecting the bumps in physical contact with each other, in such a way that the conductive bumps on the both principal surfaces of the synthetic resin sheet are press-fitted into the synthetic resin sheet to crush the tips of the bumps on both sides, and undergo plastic deformation
Implementation Method 5
the insulating resin layer is subjected to a heat treatment after the joining step to reheat the metal column, thereby re-melting the metal fillers, and forming a metallic bond between the metal column and the metallic member to integrally connect the metal column to the metallic member
Data Source
AI summary
In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.