Substrate Metal Layer Prevents Insulating Delamination
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Solution Overview
Problem
Conventional semiconductor substrates face issues with thermal stress-induced delamination of the insulating layer and warpage due to differing coefficients of thermal expansion, leading to potential damage during the singulation process.
Innovation Solution
A substrate structure with a metal layer formed on the insulating layer and substrate body, which increases bonding force and prevents cracks from extending to the layout area, thereby protecting the wiring layer and enhancing product yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the substrate body and insulating layer are bonded over a large contact area, then the bonding strength is improved, but the thermal stress release is worsened due to different coefficients of thermal expansion
Solution Approach 1:
The contact area between the substrate body and insulating layer is segmented into multiple discrete bonding regions through the metal layer configuration, rather than a continuous large-area bond. This segmentation allows different regions to accommodate thermal expansion differences independently, reducing overall thermal stress while maintaining sufficient bonding strength through distributed bonding points.
Solution Approach 2:
A composite structure is formed by introducing a metal layer between the substrate body and insulating layer. This composite material approach combines materials with different thermal expansion properties in a controlled configuration, allowing the metal layer to act as a stress buffer that accommodates CTE mismatches while maintaining mechanical bonding.
2Reliability
If the sealing member is positioned adjacent to the layout area and cutting area, then the crack blocking effect is improved, but the damage to the sealing member during singulation is worsened
Solution Approach 1:
The metal layer serves as an intermediary structure between the substrate body and insulating layer in the cutting area. This intermediary provides mechanical reinforcement that absorbs and distributes the stress of the singulation process, protecting the sealing member from direct damage while maintaining its crack-blocking function.
Solution Approach 2:
The metal layer is positioned in advance in the cutting area to provide cushioning protection before the singulation process occurs. This pre-positioned protective layer absorbs the mechanical impact and stress during cutting, preventing damage to the sealing member while maintaining its structural integrity and crack-blocking capability.
3Reliability
If the insulating layer covers a large area of the substrate body, then the electrical insulation is improved, but the delamination risk is worsened due to thermal stress
Solution Approach 1:
The metal layer configuration creates local variations in the bonding structure, with different bonding characteristics in different regions. This local quality approach allows areas with higher thermal stress to have bonding configurations that accommodate expansion, while maintaining electrical insulation coverage through the insulating layer.
Solution Approach 2:
The introduction of the metal layer changes the physical and thermal parameters of the bonding interface. By modifying the material composition and thermal properties at the interface, the structure can better accommodate thermal expansion differences, reducing delamination risk while maintaining the insulating layer's electrical insulation function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal layer effectively prevents delamination and damage to the wiring layer during singulation, improving the substrate's structural integrity and increasing product yield.
Implementation Method 1
the metal layer is formed on the insulating layer and on a third portion of the surface of the layout area... such that the bonding force between the substrate body and the insulating layer is increased
Implementation Method 2
the metal layer prevents the cracks of the cutting area of the substrate body from extending to the layout area
Implementation Method 3
the substrate body 10 and the insulating layer 12 have different coefficients of thermal expansion (CTE)... during the thermal cycle
Data Source
AI summary
A substrate structure includes: a substrate body defined with a layout area, a sealing member and a cutting area, the sealing member being adjacent to the layout area, and the cutting area being adjacent to the sealing member; a wiring layer formed on the layout area; an insulating layer formed on the layout area and the wiring layer; and a metal layer formed on the insulating layer and the layout area. The insulating layer is prevented from being delaminated due to the formation of the metal layer.