Electronic Component Substrate With Metal Posts and Bonding Wire Loops
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The integration of highly sophisticated semiconductor elements in electronic component-incorporating substrates poses a challenge in reducing the thickness of these substrates due to the limitations of using solder balls for component connection, which hinder finer wiring and the mounting of highly integrated components.
Innovation Solution
The implementation of a substrate configuration that includes a lower substrate with mounting pads, an upper substrate with connection pads, metal posts connecting these pads, bonding wires with loops accommodated in an accommodation portion, and underfill resin filling the gaps between the components, allowing for finer wiring and reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used for connection of electronic components, then connection reliability is improved, but substrate thickness cannot be reduced and mounting of highly integrated components becomes difficult
Solution Approach 1:
The connection structure is segmented into two distinct types: metal posts for vertical connections to the lower substrate and bonding wires for horizontal connections to the upper substrate. This segmentation allows each connection type to be optimized independently, enabling reduced substrate thickness while maintaining connection reliability.
Solution Approach 2:
The electronic component acts as an intermediary element between the lower substrate (with mounting pads) and upper substrate (with connection pads). By using metal posts to connect the component to the lower substrate and bonding wires to connect to the upper substrate, the system achieves reliable connections without requiring thick substrates.
2Strength
If solder balls are used for component connection, then connection strength is improved, but finer wiring and mounting of highly integrated components becomes difficult
Solution Approach 1:
The connection system is divided into metal posts for vertical mounting connections and bonding wires for horizontal interconnections. This segmentation enables the use of finer bonding wires for precise wiring to highly integrated components while maintaining strong connections through the metal posts.
Solution Approach 2:
The invention changes the connection parameters by transitioning from spherical solder balls to cylindrical metal posts with lateral bonding wire connections. This parameter change enables finer wiring precision while maintaining adequate connection strength through the combined metal post-bonding wire structure.
3Length of stationary object
If metal posts and bonding wires are used instead of solder balls, then substrate thickness is reduced and finer wiring is enabled, but connection complexity increases
Solution Approach 1:
The connection structure is segmented into standardized metal posts for vertical connections and bonding wires for horizontal connections. This segmentation, while appearing complex, actually simplifies the overall design by allowing each component to be optimized independently and assembled in a systematic manner.
Solution Approach 2:
The metal posts serve multiple functions: providing mechanical support, enabling electrical connection to the lower substrate, and serving as anchor points for bonding wires. This multi-functionality reduces the need for additional separate components, thereby managing complexity.
4Volume of moving object
If the substrate is reduced in thickness to accommodate highly integrated components, then space occupation is reduced, but connection reliability using solder balls deteriorates
Solution Approach 1:
The invention transitions from a single-dimension vertical solder ball connection to a multi-dimensional connection structure using metal posts for vertical connections and bonding wires for lateral connections. This dimensional change enables reduced substrate thickness while maintaining connection reliability through the multi-dimensional connection path.
Data Source
AI summary
An electronic component-incorporating substrate includes a lower substrate, an upper substrate, an electronic component located between the upper and lower substrates, a metal post connecting a first connection pad of the electronic component to a mounting pad of the lower substrate, a bonding wire connecting a second connection pad of the electronic component to a connection pad of the upper substrate, and an underfill resin filling the space between the electronic component and the lower substrate. The underfill resin covers the metal post and a first end of the bonding wire connected to the second connection pad of the electronic component. The bonding wire further includes a loop located at a lower position than a lower end of the metal post. The lower substrate further includes an accommodation portion that accommodates the loop.