Substrate Surface Processing for Metal Residue Removal After Grinding
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Solution Overview
Problem
Existing substrate processing methods struggle to effectively clean the substrate surface after grinding, leading to potential metal residue and degraded product performance.
Innovation Solution
A substrate processing method that includes grinding the substrate surface, followed by etching with an etching liquid and then cleaning with a dedicated cleaning liquid to remove any adhering metal, thereby ensuring thorough surface cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If only grinding is performed on the substrate surface, then manufacturing efficiency is maintained, but metal residue adheres to the surface degrading product performance
Solution Approach 1:
The patent divides the surface treatment process into three distinct segments: grinding, etching, and cleaning. Each segment addresses a specific aspect of surface preparation, with the etching step specifically targeting metal residue removal through chemical reaction, followed by a dedicated cleaning step to eliminate etching byproducts, thereby resolving the metal contamination issue without compromising manufacturing efficiency
Solution Approach 2:
The patent introduces an intermediary etching liquid that chemically reacts with metal residues to form soluble compounds, acting as a mediator between the grinding process and final cleaning. This intermediary step transforms the harmful metal residue into a removable form, enabling effective contamination removal while maintaining process efficiency
2Reliability
If etching is performed to remove metal residue, then cleaning effectiveness improves, but process complexity increases
Solution Approach 1:
The patent combines the etching and cleaning functions into an integrated process sequence where the etching liquid serves dual purposes: removing metal residues through chemical reaction and preparing the surface for subsequent cleaning. This merging of functions achieves effective contamination removal while avoiding the need for separate complex treatment systems
Solution Approach 2:
The etching liquid is designed to self-limit its action by selectively reacting with metal residues while sparing the substrate material. The chemical composition and concentration are optimized to automatically stop etching when metal residues are consumed, eliminating the need for complex monitoring and control systems to prevent over-etching
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for appropriate cleaning of the substrate surface after grinding, ensuring the removal of metal residue and maintaining product performance.
Implementation Method 1
etching the surface of the substrate by supplying an etching liquid to the surface of the substrate after being ground
Implementation Method 2
removing a metal adhering to the surface of the substrate by supplying a cleaning liquid to the surface of the substrate after being etched
Data Source
AI summary
A substrate processing method of processing a substrate includes grinding a surface of the substrate; etching the surface of the substrate by supplying an etching liquid to the surface of the substrate after being ground; and removing a metal adhering to the surface of the substrate by supplying a cleaning liquid to the surface of the substrate after being etched. Further, a substrate processing system of processing the substrate includes a grinding device configured to grind the surface of the substrate; an etching liquid supply configured to etch the surface of the substrate by supplying the etching liquid to the surface of the substrate after being ground; and a cleaning liquid supply configured to remove the metal adhering to the surface of the substrate by supplying the cleaning liquid to the surface of the substrate after being etched.