Substrate Metal Tile Layout for Deformation Control
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Solution Overview
Problem
Substrate structures face deformation and structural weakness due to differences in metal structure proportions between opposite surfaces, leading to stress and damage at high temperatures, which conventional metal mesh layers struggle to adequately address.
Innovation Solution
Forming metal tiles on the substrate surfaces with a minimum pitch that serves as the minimum process pitch, increasing distribution density and range, thereby enhancing structural strength and controlling metal structure proportions between surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If metal mesh layers are added on both surfaces to balance metal structure proportions, then deformation is reduced, but the distribution density and range of metal structure is limited
Solution Approach 1:
The patent divides the continuous metal mesh layer into discrete metal tiles arranged in specific patterns. This segmentation allows for higher distribution density of metal structures while maintaining the balancing effect between opposite surfaces, resolving the contradiction between deformation control and metal structure distribution density
Solution Approach 2:
The patent introduces metal tiles at multiple vertical layers within the substrate structure, transitioning from a two-dimensional surface approach to a three-dimensional distributed structure. This dimensional change enables broader distribution range and higher density of metal structures while effectively controlling deformation through balanced metal proportions across surfaces
2Ease of manufacture
If mask is extended in exposing process to make it flat, then manufacturing is easier, but the interval between traces and metal mesh wire becomes wider, reducing control precision
Solution Approach 1:
By segmenting the metal structure into discrete tiles rather than using continuous mesh, the patent allows for greater manufacturing flexibility in mask preparation while maintaining precise control over the spacing and positioning of individual metal tiles relative to traces, thus resolving the contradiction between ease of manufacture and manufacturing precision
Solution Approach 2:
The patent changes the geometric parameters of the metal structure from fine mesh patterns to larger discrete tiles with defined pitch relationships. This parameter change allows the mask to be extended for easier manufacturing while the tile pitch can be controlled to maintain appropriate intervals from traces, resolving the precision issue
Data Source
AI summary
A substrate structure is provided. The substrate structure includes a number of traces, a substrate core, a number of first metal tiles, a number of second metal tiles, a number of first electrically-functioning circuits, and a number of second electrically-functioning circuits. The substrate core has a first surface and a second surface opposite to the first surface. The traces, the first metal tiles, and the first electrically-functioning circuits are disposed on the first surface and add up to a first metal structure proportion, and the second metal tiles and the second electrically-functioning circuits are disposed on the second surface and add up to a second metal structure proportion. The difference between the first metal structure proportion and the second metal structure proportion is within 15%.