Substrate Module Housing Layout for Compact Upright PCB Mounting
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Solution Overview
Problem
There is a need for electronic apparatuses that are smaller in size and weight, as existing devices are limited in this regard.
Innovation Solution
The design incorporates a housing with protrusions and holes that guide and secure substrate modules, eliminating the need for internal guide members, thereby reducing the apparatus's size and weight while improving assembly and maintenance workability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If internal guide members are used to guide and secure substrate modules, then positioning accuracy and secure attachment are improved, but device size and weight increase
Solution Approach 1:
The patent merges the guide member and housing into a single integrated structure. The guide member is formed as an integral part of the housing through injection molding, eliminating the need for separate guide member components. This combining of functions reduces the overall device weight while maintaining the positioning and guiding capabilities necessary for substrate module attachment.
Solution Approach 2:
The housing serves multiple functions: it provides structural support, guides substrate module positioning, and secures modules through integrated guide members. By making the housing multi-functional, the patent eliminates the need for separate dedicated guide members, thereby reducing device weight while maintaining positioning accuracy.
2Manufacturing precision
If internal guide members are used to guide and secure substrate modules, then positioning accuracy and secure attachment are improved, but device size increases
Solution Approach 1:
The guide member is integrated into the housing structure through injection molding, eliminating the need for separate guide member components. This merging reduces the overall device footprint and size while maintaining the positioning and guiding functionality required for accurate substrate module attachment.
Solution Approach 2:
The patent utilizes thin-walled injection molded structures for the housing and guide members. This approach allows the creation of lightweight, compact guide structures that provide necessary mechanical guidance without adding significant bulk or size to the device.
3Ease of manufacture
If multiple separate components are used for housing and guide members, then manufacturing flexibility is improved, but device complexity and cost increase
Solution Approach 1:
The housing and guide members are combined into a single injection molded part. This integration reduces the total component count, simplifies assembly procedures, and lowers manufacturing complexity while maintaining design flexibility through modular substrate module attachments.
Solution Approach 2:
The integrated housing structure performs multiple functions including structural support, guidance, and module securing. This multi-functionality reduces the number of separate components needed, thereby decreasing device complexity and assembly steps while maintaining manufacturing flexibility.
Data Source
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AI summary
An electronic apparatus includes a housing, a first substrate, and at least one substrate module. The housing includes a bottom plate and a plurality of side plates perpendicular to the bottom plate. At least one side plate among the plurality of side plates includes a protrusion protruding toward an inside of the housing. The first substrate is parallel with the bottom plate. The at least one substrate module stands upright on the first substrate, and includes a second substrate and a substrate fixing member to which the second substrate is fixed. The substrate fixing member includes a hole engaged with the protrusion of the at least one side plate.