Substrate Moisture Removal Using Weight Feedback and Supercritical Drying
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Solution Overview
Problem
Existing substrate processing systems face challenges in effectively removing moisture from substrates during semiconductor fabrication, leading to contamination and potential damage, which can reduce yield and efficiency in the manufacturing process.
Innovation Solution
A substrate processing system and method that involves measuring the weight of the substrate to determine moisture content, heating to remove moisture, followed by a wetting process and a drying process using a supercritical fluid to prevent contamination and minimize damage, thereby enhancing the cleaning efficiency and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If moisture is removed from the substrate by conventional heating methods, then moisture content is reduced, but substrate damage and contamination increase
Solution Approach 1:
The patent employs phase transition of water from liquid to vapor through controlled heating, and utilizes the weight change during this phase transition to precisely control moisture removal. The system monitors weight reduction in real-time to determine when moisture evaporation is complete, preventing overheating and substrate damage while ensuring thorough moisture removal.
Solution Approach 2:
The patent implements a feedback control system using weight detection sensors that continuously monitor substrate weight during the drying process. The controller adjusts heating power based on weight change rate, reducing heating when weight stabilizes (indicating moisture removal completion) to prevent substrate damage from excessive heating, while ensuring complete moisture elimination.
2Quantity of substance
If the substrate is heated to remove moisture, then moisture content decreases, but the processing time increases
Solution Approach 1:
The weight-based feedback system enables real-time monitoring of moisture removal progress. By detecting weight change rate, the system dynamically adjusts heating intensity to optimize drying speed while preventing substrate damage. This allows faster processing compared to conventional fixed-time heating, as the system applies maximum safe heating power until moisture removal is complete.
Solution Approach 2:
The system performs preliminary weight measurement before heating to determine initial moisture content, allowing the controller to pre-calculate required heating duration and intensity. This preliminary assessment enables optimized processing time from the start, avoiding both insufficient drying and excessive processing time.
3Device complexity
If conventional drying methods are used, then processing is simpler, but contamination and substrate damage occur
Solution Approach 1:
The patent replaces conventional mechanical drying methods (such as nitrogen blowing or centrifugal drying) with a controlled thermal evaporation process monitored by weight detection. This substitution eliminates mechanical contact that could cause contamination or damage, while the precise weight-based control ensures complete moisture removal without overheating.
Solution Approach 2:
The patent introduces weight detection sensors and a controller as intermediaries between the heating element and substrate. These intermediaries provide precise feedback control, allowing the system to automatically adjust heating to prevent substrate damage and contamination while ensuring thorough moisture removal, making the process safer despite increased instrument complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively removes moisture to prevent contamination and reduce substrate damage, improving the yield and efficiency of semiconductor device manufacturing by ensuring thorough drying and cleaning without damaging the substrate.
Implementation Method 1
heating the substrate whose weight is measured
Implementation Method 2
heating to remove moisture
Implementation Method 3
supplying the substrate with a supercritical fluid to dry a fluid on the substrate
Data Source
AI summary
Disclosed are substrate processing systems and substrate processing methods. The substrate processing method comprises performing an exposure process on a substrate, removing moisture on the substrate after the exposure process, performing a wetting process on the substrate from which the moisture is removed, and performing a drying process on the substrate after the wetting process. The step of removing the moisture on the substrate includes measuring a weight of the substrate and heating the substrate whose weight is measured. The step of performing the drying process on the substrate includes placing the substrate into a dry chamber and supplying the dry chamber with a supercritical fluid to dry a fluid on the substrate.