Substrate Processing Mold and Nozzle for Edge Protection
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Solution Overview
Problem
In semiconductor manufacturing, existing substrate processing technologies face challenges in protecting the outer peripheral edges of substrates during reactive ion etching and subsequent wet etching, leading to potential damage and thinning of thin films with large steps, especially in three-dimensional stacked layer type semiconductor memories.
Innovation Solution
A substrate processing device with a mold and nozzle system that injects and cures thermosetting resist to form a protection ring around the outer peripheral edge of the substrate, preventing penetration during reactive ion etching and damage from wet etching by closely matching the mold to the substrate shape and using a height detection mechanism to ensure precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mold and nozzle system is introduced to form a protection ring, then substrate edge protection is improved, but device complexity increases
Solution Approach 1:
A mold is introduced as an intermediary component that positions a protection ring between the substrate edge and the etching environment. The mold includes a cavity that receives the protection ring and positioning protrusions that ensure accurate placement, thereby protecting substrate edges without requiring complex integrated solutions
Solution Approach 2:
The protection system is segmented into separate functional components: the mold (for positioning and support), the protection ring (for actual protection), and the nozzle system (for applying materials). This segmentation allows each component to be optimized independently while maintaining overall system reliability
2Manufacturing precision
If precise positioning is achieved through height detection mechanism, then manufacturing precision is improved, but device complexity and cost increase
Solution Approach 1:
The mold includes self-positioning features such as positioning protrusions that fit into corresponding recesses on the substrate, and a bottom surface designed to contact the substrate at specific points. This self-service positioning mechanism achieves high precision without requiring complex external detection and adjustment systems
Solution Approach 2:
The mold is pre-configured with positioning features and dimensions that ensure accurate placement on the substrate before the etching process begins. The protection ring is also pre-formed to match the substrate edge geometry, eliminating the need for complex real-time adjustment mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents thinning and damage to the substrate by forming a protective ring that shields the edges from etching processes, ensuring accurate pattern formation and maintaining the integrity of the semiconductor substrate during processing.
Implementation Method 1
a mold having a first surface facing an upper surface of an outer peripheral edge of the substrate and a second surface facing a side surface of an outer peripheral continuous with the upper surface of the outer peripheral edge
Data Source
AI summary
According to one embodiment, a substrate processing device includes a stage configured to mount a substrate, a mold having a first surface facing an upper surface of an outer peripheral edge of the substrate and a second surface facing a side surface of an outer peripheral continuous with the upper surface of the outer peripheral edge, a mold moving mechanism configured to move the mold to bring the first surface close to the upper surface of the outer peripheral edge of the substrate and the second surface close to the side surface of the outer peripheral of the substrate, and a nozzle arranged in the mold, wherein the nozzle ejects resist.