Substrate Mounting Mechanism Temperature Control Jacket
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Solution Overview
Problem
In semiconductor wafer CVD film forming processes, film deposition occurs not only on the wafer but also on the heater plate, leading to thermal stress and particle generation, which deteriorates production yield due to the deposition temperature influencing the heater plate's thermal expansion and contraction.
Innovation Solution
A substrate mounting mechanism with a heater plate and a temperature control jacket, where the heater plate is heated to a deposition temperature and the temperature control jacket, covering the heater plate's surface except the mounting area, is maintained at a non-deposition temperature, preventing film deposition on the jacket.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the heater plate is heated to deposition temperature to enable film deposition on the substrate, then the substrate can be processed, but film is deposited on the heater plate causing thermal stress and particle generation
Solution Approach 1:
The heater plate is divided into two functional zones: a substrate mounting surface maintained at deposition temperature for film formation, and a peripheral surface maintained at non-deposition temperature to prevent film deposition. This segmentation allows differential temperature control across different regions of the same component, eliminating particle generation from the heater plate while preserving substrate processing capability.
Solution Approach 2:
Different regions of the heater plate are assigned different temperature characteristics: the central substrate mounting area is heated to deposition temperature to enable film deposition, while the peripheral areas are kept at non-deposition temperature to prevent film formation. This local differentiation of thermal properties resolves the contradiction between enabling film deposition and preventing harmful film formation on the heater plate.
2Manufacturing precision
If the heater plate is heated to deposition temperature, then film deposition can occur on the substrate, but the deposited film undergoes thermal expansion and contraction causing peeling
Solution Approach 1:
The heater plate is segmented into a heated substrate mounting zone and a non-heated peripheral zone. By confining the high temperature region only to the substrate mounting surface, the deposited film experiences stable thermal conditions without the repeated heating and cooling cycles that cause thermal stress and peeling, while still enabling film deposition on the substrate.
Solution Approach 2:
The heater plate provides localized heating only where needed (substrate mounting surface) while keeping other regions at non-deposition temperature. This creates a stable thermal environment for the deposited film, preventing thermal expansion and contraction-induced peeling, while maintaining the capability for film deposition on the substrate.
3Temperature
If the entire heater plate is heated to deposition temperature, then uniform heating is achieved, but film deposition occurs on the heater plate surface
Solution Approach 1:
The heater plate is segmented into distinct thermal zones: the substrate mounting surface is heated to deposition temperature for uniform substrate heating, while the peripheral surface is maintained at non-deposition temperature. This segmentation achieves both uniform substrate heating and precise control over film deposition location, preventing film formation on the heater plate.
Solution Approach 2:
Different regions of the heater plate are assigned different temperature qualities: the substrate mounting area receives heated treatment for uniform substrate temperature, while peripheral areas receive non-heated treatment to prevent film deposition. This local differentiation resolves the contradiction between temperature uniformity and film deposition control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures film deposition only on the semiconductor wafer, reducing particle generation and improving production yield by preventing film formation on the heater plate, thus enhancing the quality and reducing maintenance needs in the processing chamber.
Implementation Method 1
a heater embedded in the heater plate to heat the target substrate to a deposition temperature at which a film is deposited
Implementation Method 2
a temperature control jacket formed to cover at least a surface of the heater plate other than the substrate mounting surface and having a non-deposition temperature below the deposition temperature
Data Source
AI summary
A substrate mounting mechanism on which a target substrate is placed is provided. The substrate mounting mechanism includes a heater plate, which has a substrate mounting surface on which the target substrate is placed and has a heater embedded therein to heat the substrate to a deposition temperature at which a film is deposited. The substrate mounting mechanism also includes a temperature control jacket, which is formed to cover at least a surface of the heater plate other than the substrate mounting surface and adjusts the temperature to a non-deposition temperature below the deposition temperature.