Substrate Mounting Table Thermal Isolation
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Solution Overview
Problem
Conventional substrate mounting tables with metal materials and dual coolant passageways face challenges in achieving precise temperature control due to heat transfer issues, leading to non-uniform temperature distribution and processing inefficiencies during semiconductor wafer processing.
Innovation Solution
Incorporating independently provided passageways with a temperature control medium and insulation or gaps between them, allowing for enhanced independent temperature control and reduced temperature control time, with options for thermal isolation and pressure control in the substrate mounting table.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If two coolant passageways are provided in the substrate mounting table to offset non-uniform temperature distribution, then temperature uniformity in the wafer surface is improved, but heat transfer between passageways reduces temperature controllability and makes rapid temperature control difficult
Solution Approach 1:
The substrate mounting table is divided into multiple independent temperature control regions with separate coolant passageways. Each passageway is thermally isolated from others using insulation parts, allowing independent temperature control of different table regions. This segmentation enables precise temperature distribution control without heat interference between zones.
Solution Approach 2:
Insulation parts are introduced as intermediary elements between adjacent coolant passageways. These insulation parts act as thermal barriers that prevent heat transfer between passageways while maintaining the structural integrity of the mounting table. This intermediary approach allows each passageway to maintain its independent temperature control capability.
2Loss of energy
If metal material with excellent thermal conductivity is used for the substrate mounting table, then heat transfer efficiency is improved, but temperature distribution control precision deteriorates due to heat transfer between passageways
Solution Approach 1:
The substrate mounting table employs different thermal conductivity characteristics in different regions. Metal materials with high thermal conductivity are used in areas requiring efficient heat transfer, while insulation parts with low thermal conductivity are strategically placed between coolant passageways. This local differentiation of material properties allows efficient heat transfer where needed while preventing unwanted heat transfer between zones.
Solution Approach 2:
The mounting table structure combines metal materials and insulation materials to create a composite system. The metal portions provide efficient heat transfer and thermal stability, while the insulation portions provide thermal isolation between passageways. This composite approach optimizes both heat transfer efficiency and temperature control precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves temperature controllability, enabling uniform processing of semiconductor wafers by ensuring precise temperature control based on processing conditions, thus enhancing the reproducibility and uniformity of wafer surface processing.
Implementation Method 1
an insulation part provided between at least two of the passageways
Implementation Method 2
a plurality of passageways independently provided in the substrate mounting table, a temperature control medium flowing through the passageways
Data Source
AI summary
A substrate mounting table includes a plurality of passageways independently provided therein, a temperature control medium flowing through the passageways, and a gap formed between at least two of the passageways. In a substrate processing method for processing a substrate mounted on the substrate mounting table in a substrate processing apparatus while controlling a temperature thereof, a process is performed on the substrate while controlling the temperature of the substrate by flowing the temperature control medium through each of the passageways. The passageways are respectively provided in a central area of the substrate mounting table and a peripheral area located outside the central area, and the central area and the peripheral area are thermally isolated from each other by evacuating the gap so as to set the gap to a vacuum state.