Semiconductor Package Substrate Layout for Signal Noise Isolation
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Solution Overview
Problem
As semiconductor packages are miniaturized and their operating speed increases, noise can affect signal integrity, leading to decreased performance and reliability.
Innovation Solution
A substrate with a body layer, a first wiring layer on its lower surface, and a second wiring layer on its upper surface, where the wiring layers include signal lines and power lines, but the power lines are routed outside the signal area to minimize noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If power lines are routed close to signal lines to reduce wiring area, then area is reduced, but noise interference increases and signal integrity deteriorates
Solution Approach 1:
The substrate is divided into a signal area and a non-signal area. Signal lines are confined to the signal area while power lines are routed in the non-signal area, creating spatial segmentation that reduces noise interference while maintaining compact design
Solution Approach 2:
Power lines are extracted from the signal area and routed outside of it. This separation removes the noise source from proximity to signal lines, improving signal integrity while the overall substrate area remains controlled
2Volume of moving object
If semiconductor packages are miniaturized to reduce size, then weight and volume are reduced, but noise affects signal integrity and reliability decreases
Solution Approach 1:
The substrate utilizes both upper and lower surfaces for wiring layers, effectively using three-dimensional space. This allows compact routing of power and signal lines in different layers and areas, achieving miniaturization while maintaining signal integrity through spatial separation
Data Source
AI summary
A substrate is provided. The substrate includes a body layer that includes a signal area; a first wiring layer provided on a lower surface of the body layer, the first wiring layer including a plurality of first signal lines provided in the signal area and a first power line provided outside the signal area; and a second wiring layer provided on an upper surface of the body layer, the second wiring layer including a plurality of second signal lines provided in the signal area and a second power line provided outside the signal area.