Substrate Notch Alignment Before Drying After Batch Processing

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Solution Overview

Problem

Existing substrate processing systems face challenges in maintaining consistent process performance across multiple substrates due to variations in notch positions and warping during batch processing, leading to issues like pattern collapse and uneven processing.

Innovation Solution

The system identifies the position of a cutout on each substrate after batch processing and rotates it to align with a specific position before single-substrate processing, ensuring consistent processing by using imaging units to adjust notch positions and employing supercritical drying to prevent pattern collapse.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If batch processing is used to process multiple substrates at once, then productivity is improved, but manufacturing precision deteriorates due to variations in notch positions and warping

Engineering Contradiction:
Improveprocessing throughputVSAvoidnotch position consistency
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system performs preliminary identification of notch positions using imaging units before the drying process, and pre-rotates substrates to align notches to reference positions. This preliminary alignment prevents pattern collapse during drying by ensuring proper orientation before the substrate is vulnerable to surface tension forces.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system uses imaging units to detect actual notch positions on processed substrates, compares them against reference positions, and automatically adjusts substrate orientation accordingly. This closed-loop feedback mechanism compensates for variations introduced during batch processing, maintaining manufacturing precision across all substrates.

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If substrates are processed one by one in single-substrate processing section, then manufacturing precision is improved, but productivity deteriorates

Engineering Contradiction:
Improveprocessing consistencyVSAvoidprocessing throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The batch processing section is equipped with imaging units and rotation mechanisms that enable it to perform self-alignment and self-correction of substrate orientations. This allows the batch processor to maintain the precision typically associated with single-substrate processing while retaining high throughput capabilities, eliminating the need for sequential processing.

Inventive Principle:
Principle #25Self-service

3Loss of time

If substrates are dried without rotating to align notch positions, then processing time is reduced, but pattern collapse occurs due to surface tension

Engineering Contradiction:
Improvedrying timeVSAvoidpattern integrity
Core Design Contradiction:
Loss of timeVSReliability

Solution Approach 1:

The system performs preliminary rotation of substrates to align notches to reference positions before the drying process begins. This ensures that when liquid is removed during drying, the substrate maintains proper orientation and structural integrity, preventing pattern collapse while enabling efficient drying without unnecessary delays.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances process consistency by aligning notch positions, reducing variations in processing performance and preventing pattern collapse, thereby improving overall substrate quality and efficiency.

Implementation Method 1

identifying a position of a cutout provided on an outer periphery of a substrate subjected to the batch processing

Methodology Applied
Scientific EffectOptical detection: Photography

Implementation Method 2

The performing the single-substrate processing includes drying the substrate

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS20260040860A1Substrate processing method and substrate processing system
Publication Date: 2026.02.05 TOKYO ELECTRON LTD
  • US20260040860A1 patent drawing
  • US20260040860A1 patent drawing
  • US20260040860A1 patent drawing

AI summary

A substrate processing method according to an aspect of the present disclosure includes performing a batch processing to process a plurality of substrates at once, performing a single-substrate processing to process the plurality of substrate one by one after the batch processing, identifying a position of a cutout provided on an outer periphery of a substrate subjected to the batch processing, and rotating the substrate such that the identified position of the cutout reaches a first position. The performing the single-substrate processing includes drying the substrate, and the rotating the substrate is performed before the drying the substrate.