Substrate Liquid Nozzle Flow Paths for Uniform Wafer Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in achieving even processing of substrates due to uneven chemical liquid flow rates and temperature maintenance, leading to processing unevenness and reduced effectiveness.
Innovation Solution
A substrate processing apparatus with a processing liquid supplying unit that includes a first flow path facing the central region and a second flow path facing the peripheral region, where the second flow path supplies processing liquid to the first flow path, maintaining temperature and flow rate disparities, and a moving unit to ensure adjacent positioning of the flow paths, thereby maintaining high temperature and reducing unevenness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single flow path is used to supply chemical liquid to the substrate, then the device complexity is reduced, but processing unevenness occurs due to flow rate differences between central and peripheral regions
Solution Approach 1:
The flow path is divided into multiple independent flow paths (first flow path for central region, second flow path for peripheral region). Each flow path can independently control flow rate and temperature, allowing separate optimization for different substrate regions. This segmentation resolves the contradiction by enabling precise flow control without requiring a single complex unified system.
Solution Approach 2:
Different flow paths are designed with different characteristics suitable for their respective target regions. The first flow path supplies chemical liquid to the central region with specific flow rate and temperature, while the second flow path supplies to the peripheral region with different parameters. This local quality approach allows each region to receive optimally tailored chemical liquid delivery.
2Device complexity
If chemical liquid is supplied through a long flow path from the arm, then the device structure is simplified, but temperature loss occurs due to cooling in the arm and discharge head
Solution Approach 1:
The supply system is segmented into multiple independent flow paths, each with its own discharge head positioned close to the substrate. This eliminates the need for a single long flow path through the arm, reducing the distance chemical liquid travels and minimizing temperature loss while maintaining structural simplicity.
Solution Approach 2:
Instead of extending the flow path horizontally through the arm, the discharge heads are positioned in a different spatial arrangement directly above the substrate surface. This dimensional change reduces the effective flow path length and minimizes exposure to ambient cooling while achieving the same supply function.
3Device complexity
If the chemical liquid discharge head is positioned above the rotational center, then the device structure is simplified, but flow rate to peripheral region is insufficient causing processing unevenness
Solution Approach 1:
The single discharge head positioned at the center is segmented into multiple discharge heads positioned at different locations (central and peripheral regions). Each discharge head independently supplies chemical liquid to its specific region, ensuring adequate flow rate distribution across the entire substrate surface while maintaining a relatively simple overall structure.
Solution Approach 2:
Different discharge heads are positioned at different locations to provide locally optimized chemical liquid supply. The first discharge head supplies the central region while the second discharge head supplies the peripheral region, ensuring each region receives appropriate flow rates for uniform processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures even processing of substrates by adjusting flow rates and maintaining high temperature of the processing liquid, reducing processing unevenness and enhancing processing efficiency.
Implementation Method 1
a second flow path which extends as turning back from the one end part and supplies the processing liquid to the one end part
Data Source
AI summary
A substrate processing apparatus includes a substrate holding unit which holds a substrate horizontally, a processing liquid supplying unit which has a processing liquid nozzle discharging a processing liquid and supplies the processing liquid to an upper surface of the substrate, and a moving unit which moves the processing liquid supplying unit between a process position at which the processing liquid nozzle faces the upper surface of the substrate and a retreat position at which the processing liquid nozzle retreats from positions at which the processing liquid nozzle faces the upper surface of the substrate, wherein the processing liquid supplying unit includes a first flow path which is formed in the processing liquid nozzle, the first flow path having one end part and the other end part that face acentralregion of the substrate and a peripheral region of the substrate, respectively, in a state where the processing liquid supplying unit is positioned at the process position, a second flow path which extends as turning back from the one end part and supplies the processing liquid to the one end part, and a plurality of discharge ports which are formed in the processing liquid nozzle, are arranged along a direction in which the first flow path extends, and discharge the processing liquid in the first flow path to the upper surface of the substrate.