Substrate Processing Apparatus Nozzle Ingress Prevention

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Solution Overview

Problem

Conventional substrate processing apparatuses face challenges in uniformly processing both the upper and lower surfaces of a substrate, particularly in preventing the flow of processing liquids into gas ejection nozzles and maintaining temperature uniformity, especially at the outer edge portions of the substrate.

Innovation Solution

The apparatus includes an annular supporting part for the outer edge of the substrate, a lower surface facing part with a sloped surface for guiding processing liquids, and multiple gas ejection nozzles with varying distances from the central axis to heat the substrate uniformly, along with a sealed space mechanism to control inert gas and chemical liquid supply and exhaust, ensuring uniform processing and preventing liquid flow into nozzles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a gas ejection nozzle is provided facing the lower surface of the substrate to heat it, then temperature uniformity can be improved, but processing liquid may flow into the gas ejection nozzle causing failure

Engineering Contradiction:

Improvetemperature uniformityVSAvoidgas ejection nozzle reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The gas ejection nozzle is positioned at the lower surface facing part rather than directly facing the lower surface of the substrate. This spatial repositioning in another dimension (from direct contact to indirect heating through the substrate thickness) prevents liquid ingress while maintaining heating capability

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The substrate itself acts as an intermediary medium between the gas ejection nozzle and the heating target. The heated gas flows through the substrate thickness to heat the lower surface, preventing direct contact between processing liquid and the nozzle while achieving the desired thermal effect

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If the substrate is rotated during processing, then inplane uniformity of processing can be improved, but the outer edge portion temperature decreases due to centrifugal force

Engineering Contradiction:

Improveinplane uniformityVSAvoidouter edge temperature

Core Design Contradiction:

Manufacturing precisionVSTemperature

Solution Approach 1:

The gas ejection nozzle is positioned at a specific location (lower surface facing part) rather than uniformly distributed, creating a localized heating source that compensates for the centrifugal cooling effect at the outer edge during substrate rotation

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The heating action is applied in advance to the outer edge region through the strategically positioned gas ejection nozzle, counteracting the centrifugal force effect before it causes significant temperature decrease during rotation

Inventive Principle:

Principle #9Preliminary anti-action

3Loss of energy

If a cup is provided to capture scattered removal liquid, then vaporization can be reduced, but gas containing chemical liquid component cannot be exhausted properly

Engineering Contradiction:

Improvevaporization lossVSAvoidchemical gas emission

Core Design Contradiction:

Loss of energyVSObject-generated harmful factors

Solution Approach 1:

The cup structure is removed entirely from the system. Instead of capturing scattered liquid, the patent uses a different approach by positioning the gas ejection nozzle to prevent liquid ingress, thereby eliminating the need for a cup and its associated exhaust problems

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The potential harm of scattered processing liquid is converted into a benefit by using the substrate rotation and positioning to naturally guide liquid away from critical components, eliminating the need for additional containment structures

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for uniform processing on both surfaces of the substrate, improves temperature distribution, and reduces the consumption of chemical liquids, enhancing processing uniformity and reducing operational costs.

Implementation Method 1

ejecting heated gas toward the lower surface of the substrate

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

a lower surface facing part having a sloped surface for guiding processing liquids

Methodology Applied

Scientific EffectGravity-driven flow: Gravitation

Data Source

PatentUS10755951B2Substrate processing apparatus and substrate processing method

Publication Date: 2020.08.25 SCREEN HOLDINGS CO LTD

AI summary

In a substrate processing apparatus, an outer edge portion of a substrate in a horizontal state is supported from below by an annular substrate supporting part, and a lower surface facing part having a facing surface facing a lower surface of the substrate is provided inside the substrate supporting part. A gas ejection nozzle for ejecting heated gas toward the lower surface is provided in the lower surface facing part, and the substrate is heated by the heated gas when an upper surface of the rotating substrate is processed with a processing liquid ejected from an upper nozzle. Further, a lower nozzle is provided in the lower surface facing part, to thereby perform a processing on the lower surface with a processing liquid. Since the gas ejection nozzle protrudes from the facing surface, a flow of the processing liquid into the gas ejection nozzle can be suppressed during the processing.