Substrate Processing Nozzle Labyrinth Seal Mechanism
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in maintaining a sealed environment to prevent external atmosphere entry, leading to inefficiencies in processing and apparatus size due to complex labyrinth configurations and pressure variations.
Innovation Solution
A substrate processing apparatus with a rotating substrate holder and opposing member featuring a labyrinth seal mechanism, where a seal gas is supplied to the nozzle gap between the processing liquid nozzle and the opposing-member tubular part, and a seal-gas flow rate controller adjusts the gas flow based on pressure differences to maintain a sealed environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a barrier-side labyrinth member is fixed to the upper surface of the barrier plate flange and a nozzle-side labyrinth member is disposed above it, then sealing against external atmosphere entry is improved, but the apparatus size in the up-down direction increases
Solution Approach 1:
The nozzle-side labyrinth member is positioned within the space defined by the barrier-side labyrinth member and the nozzle holder, creating a nested configuration where the seal gas flows through concentric labyrinth paths. This nesting approach provides effective sealing while minimizing the vertical space required compared to extended labyrinth structures.
Solution Approach 2:
A seal gas supply mechanism introduces pressurized seal gas into the labyrinth structure to create a pneumatic barrier that prevents external atmosphere from entering the processing space. The seal gas flows through the labyrinth passages, maintaining positive pressure to block contaminant ingress without requiring physically extensive sealing structures.
2Productivity
If the pressure in the space between the barrier plate and the wafer varies and becomes lower than external pressure, then processing is improved, but the sealing between labyrinths may be broken and external atmosphere may enter
Solution Approach 1:
The seal gas acts as an intermediary substance introduced into the labyrinth structure to maintain pressure balance. When processing creates negative pressure in the wafer space, the seal gas flows through the labyrinth passages to counterbalance the pressure difference, preventing external atmosphere from being drawn into the processing space while allowing the processing space to maintain its required pressure conditions.
Solution Approach 2:
The sealing system applies local quality control by introducing seal gas specifically at the labyrinth interface where pressure differentials occur. This localized gas supply creates a pressure barrier precisely where needed to prevent atmosphere entry, while the rest of the processing space can operate under its required pressure conditions for optimal processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses external atmosphere entry, achieves apparatus flattening (miniaturization), and ensures consistent processing conditions by controlling seal gas flow rates in response to pressure variations and processing type changes.
Implementation Method 1
a seal gas is supplied to a space (nozzle gap) between the processing liquid nozzle and the opposing-member tubular part
Implementation Method 2
a labyrinth is formed as a result of the raised portion of one of the first uneven part and the second uneven part being disposed within the recessed portion of the other of the first uneven part and the second uneven part with a gap therebetween
Data Source
AI summary
A substrate processing apparatus has a labyrinth around a processing liquid nozzle above a nozzle gap, and a seal gas is supplied to the labyrinth to seal the nozzle gap from an external space. Consequently, the entry of the atmosphere of the external space into a processing space through the nozzle gap can be suppressed. An opposing-member flange part of a top plate has a first uneven part on the upper surface, and a holder body of an opposing-member moving mechanism has a second uneven part on the lower surface. The labyrinth is formed by raised portions of one of the first and second uneven parts being disposed within recessed portions of the other of the first and second uneven parts with a gap therebetween only when the top plate is located at a second position (i.e., the processing space is created). This achieves flattening of the substrate processing apparatus.