Substrate Processing Nozzle Movement for Temperature Uniformity
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in achieving uniform surface temperature during processing, leading to ineffective plating due to temperature discrepancies between the substrate's inner and outer regions when using processing fluids at different temperatures.
Innovation Solution
The apparatus employs a dual-nozzle system with a control unit that alternates between substrate entire region treatment and peripheral region treatment processes, moving nozzles in specific patterns to ensure uniform temperature distribution by discharging processing fluids of different temperatures from the first and second nozzles, respectively, and repeating these processes multiple times to adjust the treatment start positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If processing fluid of temperature different from substrate surface temperature is used, then processing effectiveness is improved, but temperature uniformity across substrate surface deteriorates
Solution Approach 1:
The substrate surface is divided into multiple regions (central region and outer regions) with different processing requirements. The processing fluid discharge is segmented into multiple stages: first discharging toward the central region, then discharging toward outer regions. This segmentation allows different temperature conditions to be applied to different regions, resolving the contradiction between processing effectiveness and temperature uniformity.
Solution Approach 2:
The processing fluid is discharged toward the central region of the substrate before discharging toward the outer regions. This preliminary action ensures that the central region receives the necessary processing treatment first, establishing a foundation for subsequent outer region treatment while managing heat distribution across the substrate surface.
2Manufacturing precision
If processing fluid is discharged from central portion toward edge portion, then preset portions can be plated, but outer region temperature becomes lower than inner region temperature
Solution Approach 1:
The plating process is segmented into distinct stages: first plating the central region by discharging processing fluid toward the central portion, then plating the outer regions by discharging processing fluid toward the edge portion. This segmentation ensures that each region receives appropriate treatment while managing temperature distribution, achieving both plating uniformity and temperature control.
Solution Approach 2:
The central region is plated first by discharging processing fluid from the central portion, establishing a baseline temperature and processing condition before proceeding to plate the outer regions. This preliminary plating action helps maintain temperature distribution while achieving uniform plating across the entire substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances temperature uniformity across the substrate surface, improving the effectiveness of the processing by ensuring consistent plating or treatment across the entire substrate.
Implementation Method 1
a processing fluid having a temperature different from a surface temperature of the substrate
Implementation Method 2
discharging the processing fluid from the first nozzle toward the substrate while moving the first nozzle
Data Source
AI summary
A substrate entire region treatment process of discharging a processing fluid of a temperature different from a surface temperature of a substrate 3 from a first nozzle 24 toward the substrate is performed while moving the first nozzle toward an outer side from an entire region treatment start position P2 located at a central portion to an entire region treatment end position P5 located at a peripheral portion. Then, after moving the first nozzle toward an inner side to a peripheral region treatment start position P6 located at an outer position than the entire region treatment start position P2, a substrate peripheral region treatment process of discharging the processing fluid from the first nozzle toward the substrate is performed while moving the first nozzle toward the outer side from the peripheral region treatment start position P6 to a peripheral region treatment stop position P7 located at a peripheral portion.