Substrate Cleaning Nozzle Sequencing to Reduce Liquid Splashing
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Solution Overview
Problem
Conventional substrate processing techniques experience significant liquid splashing when discharging a mixed fluid of cleaning liquid and gas onto a substrate, leading to nozzle contamination and particle generation.
Innovation Solution
A substrate processing apparatus with a rotational holding part, a cleaning nozzle capable of independent discharge of cleaning liquid and gas, and a liquid supply nozzle, controlled to form a liquid film on the substrate and then discharge a mixed fluid from the cleaning nozzle, which moves from the central to the peripheral part of the substrate while increasing the gas flow rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mixed fluid of cleaning liquid and gas is discharged onto the substrate to remove removal targets and clean the substrate, then cleaning effectiveness is improved, but liquid splashing occurs leading to nozzle contamination and particle generation
Solution Approach 1:
The cleaning nozzle is divided into multiple independent discharge ports: a first discharge port for cleaning liquid, a second discharge port for gas, and a third discharge port for liquid. This segmentation allows independent control of each fluid stream, enabling the system to discharge fluids in optimized sequences and patterns that achieve effective cleaning while preventing liquid splashing and nozzle contamination.
Solution Approach 2:
The system performs preliminary actions by discharging cleaning liquid to form a liquid film on the substrate before discharging the mixed fluid of cleaning liquid and gas. This preliminary liquid film formation prepares the substrate surface, allowing subsequent mixed fluid discharge to be more effective while reducing the likelihood of liquid splashing and contamination.
2Reliability
If gas flow rate is increased to enhance cleaning performance, then cleaning effectiveness is improved, but liquid splashing increases causing nozzle contamination
Solution Approach 1:
The system employs periodic action by discharging gases at different flow rates at different stages of the cleaning process. Initially, gas is discharged at a first flow rate to prepare the substrate surface. Then, the gas flow rate is increased to a second flow rate for enhanced cleaning performance. This staged approach allows high gas flow rates to be used effectively while minimizing liquid splashing and nozzle contamination through proper sequencing and timing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces or prevents liquid splashing on the substrate during the cleaning process, minimizing nozzle contamination and particle generation.
Implementation Method 1
discharges a mixed fluid of a cleaning liquid and a gas onto the substrate
Implementation Method 2
discharges the liquid from the liquid supply nozzle to a central part of the substrate to form a liquid film of the liquid on the substrate
Data Source
AI summary
A substrate processing apparatus includes a rotational holding part that holds a substrate, a cleaning nozzle that discharges a mixed fluid of a cleaning liquid and a gas onto the substrate, a liquid supply nozzle that discharges a liquid onto the substrate, and a controller, wherein the controller executes, at least, discharging the liquid from the liquid supply nozzle to a central part of the substrate, discharging the cleaning liquid from the cleaning nozzle to a central part of the substrate, discharging the gas at a first flow rate from the cleaning nozzle onto the substrate to discharge the mixed fluid to a central part of the substrate, and moving the cleaning nozzle and the liquid supply nozzle from a central part to a peripheral part of the substrate while changing a flow rate of the gas to a second flow rate that is greater than the first flow rate.