Substrate Nozzle Temperature Control for Uniform Wet Processing
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Solution Overview
Problem
Existing substrate processing technologies face challenges in maintaining consistent treatment effects, such as cleaning and polishing, due to variations in substrate processing times and temperature control issues, particularly when handling multiple substrates in continuous processing.
Innovation Solution
A substrate processing apparatus and method that include a first module, a second module, a nozzle for supplying a target treatment liquid, a temperature detector, a substrate detection sensor, and a controller. The controller manages the discharge of the treatment liquid from the nozzle before the substrate is conveyed to the second module, based on the detected temperature and substrate position, ensuring optimal temperature control and uniform processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the treatment liquid is discharged from the nozzle before substrate conveyance to maintain optimal temperature, then the processing uniformity is improved, but the treatment liquid temperature may decrease due to waiting time variations, worsening the temperature control
Solution Approach 1:
The nozzle discharges the treatment liquid in advance before the substrate is conveyed to the second module. This preliminary action ensures that the treatment liquid reaches the optimal temperature before contact with the substrate, eliminating temperature variations caused by waiting time differences in continuous substrate processing
Solution Approach 2:
The temperature detector detects the temperature of the treatment liquid inside the nozzle or the nozzle temperature in real-time, and the controller adjusts the discharge timing based on this feedback. This closed-loop control maintains the treatment liquid temperature within the optimal range while ensuring processing uniformity
2Temperature
If the nozzle waits until substrate arrival to discharge treatment liquid, then the treatment liquid temperature is maintained, but the processing time varies for each substrate, worsening the processing consistency
Solution Approach 1:
The system performs the treatment liquid discharge as a preliminary action before substrate arrival at the processing position. By discharging the treatment liquid in advance and maintaining it at optimal temperature, the system eliminates processing time variations that would otherwise affect consistency across multiple substrates
3Manufacturing precision
If the treatment liquid is discharged continuously to maintain temperature, then the temperature uniformity is improved, but the discharge of treatment liquid occurs before substrate arrival, worsening the treatment liquid waste
Solution Approach 1:
The system discharges the treatment liquid as a preliminary action for a controlled duration before substrate arrival, just enough time to reach optimal temperature. This avoids continuous discharge and minimizes treatment liquid waste while maintaining temperature uniformity
Solution Approach 2:
The treatment liquid discharge is performed periodically based on substrate processing cycles rather than continuously. The controller activates the nozzle discharge at specific intervals synchronized with substrate conveyance, reducing unnecessary discharge and treatment liquid consumption
Data Source
AI summary
A substrate processing apparatus includes: a first module used in a substrate processing process; a second module used in a substrate processing process after the first module; a nozzle provided in the second module and configured to supply a target treatment liquid; a temperature detector that detects a temperature of a treatment liquid inside the nozzle or a temperature of the nozzle; a substrate detection sensor that detects a position of a substrate; and a controller that controls discharge of the target treatment liquid from the nozzle performed before the substrate is conveyed to the second module according to the temperature of the treatment liquid detected by the temperature detector and the position of the substrate.