Integrated Substrate Measurement With Offset-Corrected Reflectometry
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Solution Overview
Problem
Current substrate processing systems face challenges in accurately measuring film thickness and uniformity across substrates due to the lack of efficient methods for detecting and correcting for substrate misalignment and process drifts, leading to non-uniformities and inefficiencies in manufacturing processes.
Innovation Solution
An integrated reflectometry system with a substrate holder that rotates and moves linearly, equipped with sensors and a processing device to estimate substrate position and correct for offsets, enabling precise measurement of film thickness and uniformity profiles across the substrate surface, even when not centered, and providing real-time monitoring and alerts for process drifts and non-uniformities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the substrate is not centered on the substrate holder, then the measurement system can still operate, but an offset occurs between the field of view of the sensor and the target position on the substrate
Solution Approach 1:
The system performs preliminary estimation of the substrate position and offset calculation before the actual measurement process. The processing device determines the offset between the substrate center and substrate holder center in advance, then pre-calculates the corrected rotation and linear movements needed to compensate for this offset, ensuring accurate measurements despite initial misalignment
Solution Approach 2:
The system uses feedback from the estimated substrate position to dynamically adjust the rotation and linear movements. The processing device continuously monitors the offset and modifies the actuator commands in real-time to maintain accurate alignment between the sensor field of view and the target positions on the substrate throughout the measurement process
2Measurement precision
If the substrate holder rotates and moves linearly to correct for substrate offset, then measurement accuracy improves, but the system complexity increases
Solution Approach 1:
The substrate holder is designed to perform multiple functions: it not only holds the substrate but also provides rotational movement and linear movement capabilities. By integrating these multiple movement functions into a single substrate holder assembly rather than separate mechanisms, the system achieves the needed measurement precision while managing overall device complexity
Solution Approach 2:
The system replaces complex mechanical alignment mechanisms with a computational approach. Instead of using intricate mechanical devices to physically align the substrate before measurement, the system uses the processing device to calculate offsets and control the actuators programmatically, substituting mechanical complexity with software-based correction
3Manufacturing precision
If real-time monitoring and correction of process drifts is implemented, then substrate quality improves, but the measurement and control time increases
Solution Approach 1:
The system implements continuous monitoring of the substrate during the deposition process rather than intermittent or post-process inspection. The sensor continuously measures film thickness and uniformity parameters, and the processing device continuously analyzes the data and adjusts process parameters in real-time, maintaining continuous useful action throughout the manufacturing process to ensure substrate quality without excessive delays
Solution Approach 2:
The system performs preliminary estimation of substrate position and offset before the actual measurement and deposition processes. By determining the substrate center and calculating offsets in advance, the system prepares the correction parameters beforehand, enabling faster real-time adjustments during the actual manufacturing process and reducing the time penalty associated with continuous monitoring
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system allows for accurate and efficient measurement of film thickness and uniformity profiles, enabling real-time correction of process parameters and reducing the risk of non-uniformities, thereby improving manufacturing efficiency and substrate quality.
Implementation Method 1
an integrated reflectometer (IR) includes a substrate holder, a first actuator, a second actuator, a first sensor
Implementation Method 2
a second sensor to generate one or more second measurements of a second plurality of target positions on the substrate
Data Source
AI summary
An optical measurement device comprises a substrate holder to secure a substrate, a plurality of actuators to move the substrate holder relative to a plurality of axes, a first sensor to generate one or more first measurements or images of a first plurality of target positions on the substrate, and a second sensor to generate one or more second measurements of a second plurality of target positions on the substrate. The optical measurement device further comprises a plate, wherein the substrate holder, the plurality of actuators, the first sensor and the second sensor are each mounted to the plate, and wherein the plate provides vibration isolation from a factory interface to which the optical measurement device mounts. The optical measurement device further comprises a processing device that executes instructions to control the plurality of actuators and process the first measurements or images and the second measurements.