Substrate Orientation Switching for Narrow-Pitch Wet Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in aligning multiple substrates at a narrow pitch for efficient processing, particularly in a face-to-face manner, leading to increased usage of processing liquids.
Innovation Solution
A substrate processing apparatus with a substrate handling mechanism and orientation changing unit that includes vertical holding units with reference and 2/N pitch holding grooves, allowing substrates to be aligned at a 1/N pitch in a face-to-face manner by switching between different groove states using a switching drive unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If substrates are aligned at half pitch in face-to-face state, then substrate processing can be performed, but the pitch cannot be narrowed further to reduce processing liquid usage
Solution Approach 1:
The holding units are designed to dynamically switch between different pitch configurations (reference pitch and 2/N pitch) through the switching drive unit. This allows the system to adapt between face-to-face alignment at half pitch and face-to-back alignment at narrower pitch, resolving the contradiction between reducing liquid usage and maintaining alignment capability
Solution Approach 2:
The invention introduces a new dimension of orientation by utilizing face-to-back alignment in addition to the conventional face-to-face alignment. This dimensional change in substrate arrangement allows for narrower pitch (1/N pitch) while maintaining proper orientation for processing, thereby reducing processing liquid requirements
2Manufacturing precision
If multiple substrate groups are processed sequentially, then alignment at narrow pitch is achieved, but processing time increases
Solution Approach 1:
The orientation changing unit pre-aligns multiple substrate groups at the reference pitch in face-to-back state before processing. This preliminary alignment at narrow pitch allows subsequent processing to proceed efficiently without requiring time-consuming realignment, thus maintaining high precision while reducing overall processing time
Solution Approach 2:
The holding units serve multiple functions: they can hold substrates at reference pitch for narrow alignment, switch to 2/N pitch for different processing requirements, and accommodate both face-to-face and face-to-back orientations. This multi-functionality allows sequential processing of multiple substrate groups without sacrificing alignment precision or significantly increasing processing time
Data Source
AI summary
An orientation changing unit of a substrate processing apparatus includes a vertical holding unit having reference pitch holding grooves and ⅔ pitch holding grooves, and a holding groove switching drive unit. The reference pitch holding grooves are disposed at a reference pitch. The ⅔ pitch holding groove are disposed at a ⅔ pitch that is ⅔ times the reference pitch. The holding groove switching drive unit switches to a state in which the reference pitch holding grooves are usable when 50 substrates aligned in a face-to-back manner are formed on a pusher member, and switches to a state in which the ⅔ pitch holding grooves are usable when the 50 substrates held by the pusher member is rearranged into a face-to-face manner.