Substrate Oxide Etching with Acid Polymer Film and Rinse Removal
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Solution Overview
Problem
The existing substrate processing methods require large amounts of chemical liquids, leading to environmental concerns due to continuous use of diluted hydrofluoric acid and hydrogen peroxide water, which results in a significant environmental load.
Innovation Solution
A substrate processing method involving the formation and removal of a semisolid or solid polymer film containing an acid polymer, which allows for controlled etching by adjusting the amount of polymer film formation and removal, reducing the need for continuous chemical supply and minimizing environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If continuously-flowing diluted hydrofluoric acid and hydrogen peroxide water are used to form and remove metal oxide layer, then substrate etching can be achieved, but a great amount of chemical liquid is consumed leading to environmental load
Solution Approach 1:
The patent changes the physical state of the etching agent from liquid to solid polymer film. The acid polymer is applied as a solution that forms a solid or semisolid film on the substrate, eliminating the need for continuous liquid flow. This parameter change from liquid to solid state allows the etching process to proceed without continuous chemical supply, significantly reducing chemical consumption while maintaining etching effectiveness
Solution Approach 2:
The acid polymer is applied in advance as a film before the etching process begins. The polymer film is formed on the substrate surface and then heated to activate the etching reaction. This preliminary application of the etching agent eliminates the need for continuous chemical supply during the etching process, reducing chemical liquid consumption while ensuring adequate etching action
2Quantity of substance
If polymer film is used for etching instead of continuous chemical flow, then chemical usage is reduced, but process complexity increases due to film formation and removal steps
Solution Approach 1:
The patent combines multiple functions into the acid polymer film: etching action, film formation, and self-limiting behavior. The polymer film serves as both the etching agent delivery mechanism and the active etching component. The film formation and removal steps are integrated into a simplified process where the polymer is applied, heated to activate etching, and then naturally removed or dissolved, reducing overall process complexity despite the initial appearance of additional steps
Solution Approach 2:
The acid polymer film exhibits self-limiting etching behavior where the etching reaction automatically stops when the desired oxide layer removal is achieved. The polymer film self-regulates the etching process without requiring continuous external control or additional chemical supply. The film can be removed by simple dissolution or desorption, eliminating the need for complex removal mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the environmental load by minimizing chemical usage and allowing precise control over the etching process, ensuring efficient substrate processing while maintaining excellent etching quality.
Implementation Method 1
forming a first polymer film that contains a first acid polymer on the major surface of the substrate and etching the substrate
Implementation Method 2
supplying a first rinsing liquid that washes the major surface of the substrate to the major surface of the substrate after the first etching step
Implementation Method 3
a first etching start step of starting etching the substrate by heating the first polymer film and evaporating the first alkali component from the first polymer film
Data Source
AI summary
A substrate processing method includes a substrate preparation step of preparing a substrate having a major surface from which a first oxide layer is exposed, a first etching step of forming a first polymer film that contains a first acid polymer on the major surface of the substrate and etching the substrate, and a first rinsing step of supplying a first rinsing liquid that washes the major surface of the substrate to the major surface of the substrate after the first etching step.