Heat Dissipation Substrate Package With Intermediary Sheets

Solution Overview

Problem

Existing methods for storing heat dissipation substrates result in reduced packing density and increased risk of substrate damage during transportation due to bulkiness and potential contact between substrates, leading to degraded transporting and preserving properties.

Innovation Solution

A package design featuring multiple heat dissipation substrates stacked with intermediate sheets under, on top of, and between each substrate, along with a drying agent and a sealed bag made of a gas-barrier material to prevent moisture and oxygen exposure, enhancing protection and efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If multiple heat dissipation substrates are stored without intermediate sheets, then packing density is improved, but substrate damage occurs due to contact between substrates

Engineering Contradiction:

Improvepacking densityVSAvoidsubstrate integrity

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The patent introduces intermediate sheets as mediator elements positioned between adjacent heat dissipation substrates. These sheets prevent direct contact and potential damage between substrates while allowing multiple substrates to be stacked efficiently. The intermediate sheets serve as protective barriers that enable higher packing density without compromising substrate integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent divides the storage space between substrates by introducing intermediate sheets, effectively segmenting the contact surfaces. This segmentation allows each substrate to be isolated from direct contact with others, reducing damage risk while maintaining compact stacking arrangements for improved packing density.

Inventive Principle:

Principle #1Segmentation

2Device complexity

If heat dissipation substrates are stored in a single resin bag without additional protection, then device complexity is reduced, but transporting property deteriorates due to substrate contact and lack of cushioning

Engineering Contradiction:

Improvepackaging structureVSAvoidtransporting property

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent introduces intermediate sheets as mediator elements positioned between adjacent heat dissipation substrates. These sheets prevent direct contact and potential damage between substrates while allowing multiple substrates to be stacked efficiently. The intermediate sheets serve as protective barriers that enable higher packing density without compromising substrate integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent implements protective measures by placing intermediate sheets between substrates before the damaging contact can occur during transportation. This beforehand cushioning approach prevents substrate damage by eliminating direct contact points that would otherwise be subjected to external forces during handling and transport.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If intermediate sheets are disposed between all adjacent heat dissipation substrates, then substrate damage is suppressed, but device complexity increases

Engineering Contradiction:

Improvesubstrate protectionVSAvoidpackaging structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces intermediate sheets as mediator elements positioned between adjacent heat dissipation substrates. These sheets prevent direct contact and potential damage between substrates while allowing multiple substrates to be stacked efficiently. The intermediate sheets serve as protective barriers that enable higher packing density without compromising substrate integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves packing density, reduces substrate damage, and maintains high preserving properties by preventing contact-induced damage and moisture exposure, thus enhancing the transporting and preserving properties of heat dissipation substrates.

Implementation Method 1

a drying agent disposed over or under the plurality of heat dissipation substrates

Methodology Applied

Scientific EffectAbsorption: Absorption (physical)

Implementation Method 2

a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent

Methodology Applied

Scientific EffectGas barrier: Diffusion Barrier

Data Source

PatentUS11912489B2Package accommodating heat dissipation substrate and packing box

Publication Date: 2024.02.27 DENKA CO LTD

AI summary

A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.