Heterogeneous Substrate Package With Direct RF-to-Antenna Connection
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Solution Overview
Problem
Conventional wireless communication devices face performance issues due to the difficulty in controlling the thickness of air layers used as dielectric substrates for antennas, leading to signal transmission loss and increased power consumption.
Innovation Solution
The electronic device package incorporates a conductive structure that penetrates through the interface between two heterogeneous substrates, directly connecting the RF circuit and antenna circuit, thereby mitigating signal transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If an air layer is used as a dielectric layer of the antenna substrate to obtain low dielectric constant, then the peak gain is improved, but the thickness of the air layer is difficult to control which seriously affects antenna performance
Solution Approach 1:
The patent introduces a foam layer as an intermediary material between the antenna substrate and the ground plane. This foam layer serves as a controlled dielectric spacer that replaces the uncontrolled air layer, maintaining the low dielectric constant benefit while providing precise thickness control through manufacturing processes.
Solution Approach 2:
The patent changes the physical state and properties of the dielectric material by using foam with controlled density and thickness parameters. By adjusting the foam's physical parameters (density, thickness, composition), the invention achieves both low effective dielectric constant and precise thickness control, resolving the contradiction between gain optimization and manufacturing precision.
2Loss of energy
If the dielectric layer thickness is increased to reduce signal transmission loss, then the signal quality is improved, but the overall device thickness increases which affects compactness
Solution Approach 1:
The patent employs a composite structure combining foam material with specific dielectric properties and conductive elements. The foam layer with optimized dielectric constant creates favorable electromagnetic conditions that reduce signal transmission loss, while the entire structure is designed with controlled thickness to maintain device compactness. This composite approach allows simultaneous optimization of signal quality and dimensional constraints.
Data Source
AI summary
An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.