3D Substrate Package Structure for IC Heat Dissipation
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Solution Overview
Problem
Conventional lead frame-based IC package structures face challenges such as high costs, limited design flexibility, poor heat dissipation, and low yield due to their planar design and lack of modular capability.
Innovation Solution
A package structure with a conductive element disposed in a through-opening of a substrate, featuring a conductive pattern or second substrate for electrical connection, and a metallic material for enhanced adhesion and reduced contact impedance, along with dispensing for encapsulation instead of molding, allowing for improved heat dissipation and design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead frame-based IC package structure is used, then manufacturing process is mature and reliable, but cost is higher and device area cannot be reduced
Solution Approach 1:
The patent transitions from a planar lead frame structure to a three-dimensional substrate structure with through-openings. The conductive element passes through the substrate vertically, creating a 3D configuration that reduces device area while maintaining electrical connectivity. This dimensional change enables miniaturization without sacrificing manufacturing reliability.
Solution Approach 2:
The package structure is divided into distinct functional modules: substrate, through-opening, conductive element, and encapsulation material. This segmentation allows independent optimization of each component and enables modular assembly, reducing overall device area and manufacturing complexity while maintaining reliability.
2Reliability
If conventional molding encapsulation is used, then protection is provided, but additional development of molding devices is required which increases cost and time
Solution Approach 1:
The patent extracts the encapsulation function from complex molding devices and implements it through simpler dispensing or gluing processes. The encapsulation material is applied directly to protect the conductive element without requiring specialized molding equipment, thereby reducing device complexity and development costs while maintaining protection capability.
Solution Approach 2:
The patent employs inexpensive encapsulation materials that can be applied through simple dispensing processes rather than expensive reusable molding devices. This approach reduces equipment investment and development time while providing adequate protection for the conductive elements.
3Ease of manufacture
If planar lead frame design is used, then manufacturing is simple, but area design capability is poor and product size cannot shrink
Solution Approach 1:
The patent employs a three-dimensional substrate structure with vertical through-openings instead of planar lead frames. The conductive element extends through the substrate thickness, utilizing the Z-dimension to achieve electrical connectivity. This enables significant reduction in device footprint area while maintaining manufacturing simplicity through standardized substrate fabrication processes.
Solution Approach 2:
The conductive element is nested within the substrate's through-opening, with the encapsulation material nested around the conductive element. This nested configuration maximizes space utilization and minimizes device area while keeping the manufacturing process straightforward and modular.
4Ease of operation
If conventional lead frame structure is used, then assembly is straightforward, but heat dissipation performance is poor
Solution Approach 1:
The substrate acts as an intermediary thermal management component between the conductive element and the external environment. The substrate provides a dedicated thermal conduction path through its structure, facilitating heat dissipation from the conductive element while maintaining straightforward assembly procedures. The encapsulation material also serves as a thermal pathway to external heat sinks.
Data Source
AI summary
The invention discloses a package structure with at least one portion of a first conductive element disposed in a through-opening of a first substrate. A conductive structure is disposed on the first substrate and the first conductive element, wherein the conductive structure is electrically connected to the first substrate and said at least one first I/O terminal of the first conductive element. The conductive structure comprises at least one of a second conductive element, a second substrate or a conductive pattern.