Substrate Packaging with Light-Diffusing Component for Laser Sealing
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Solution Overview
Problem
The existing touch display packaging process using frit to seal glass substrates often results in thermal defects like voids or cracks due to rapid heating and cooling, affecting the seal quality and efficiency.
Innovation Solution
A substrate packaging structure that includes a light-diffusing component on the upper substrate to diffuse the laser beam, increasing the irradiation area and heating time of the frit, thereby reducing thermal defects without modifying the laser beam equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser heating is performed with high temperature and short time to improve packaging efficiency, then productivity is improved, but thermal defects such as voids or cracks are produced in the frit
Solution Approach 1:
The laser beam is segmented into multiple beams by the light-diffusing component, which divides the single high-intensity beam into several lower-intensity beams. This segmentation allows the frit to be heated more uniformly and gradually, reducing thermal shock and preventing voids or cracks while still maintaining efficient packaging throughput.
Solution Approach 2:
The light-diffusing component acts as an intermediary between the laser beam and the frit. It modifies the laser beam's properties by diffusing it into multiple beams, thereby controlling the heating process to avoid thermal defects while preserving packaging efficiency. This intermediary component enables the system to achieve both high productivity and high manufacturing precision.
2Productivity
If laser heating temperature is increased to maintain short heating time, then productivity is improved, but thermal defects are produced affecting seal quality
Solution Approach 1:
By segmenting the laser beam into multiple beams, the heating load on any single point of the frit is reduced. This prevents localized overheating and thermal defects that would compromise seal quality, while the collective effect of multiple beams maintains the overall heating efficiency and productivity.
Solution Approach 2:
The light-diffusing component changes the parameters of the laser beam, specifically its spatial distribution and intensity profile. By transforming a concentrated high-intensity beam into a diffused multi-beam pattern, the system achieves more uniform heating that prevents thermal defects and ensures reliable seal quality without sacrificing productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The light-diffusing component effectively reduces thermal defects such as voids and cracks by increasing the heating time of the frit, improving seal quality without altering the existing laser beam setup, thus enhancing packaging efficiency and reducing costs.
Implementation Method 1
the laser beam is diffused by the light-diffusing component so that the irradiation angle thereof is increased
Implementation Method 2
the laser beam heats and sinters the frit to adhere two glass substrates
Implementation Method 3
owing to the thermal shock (rapid heating and cooling), the thermal defects, for example, voids or cracks are produced in the frit
Implementation Method 4
the laser beam heats and sinters the frit to adhere two glass substrates so that two glass substrates are sealed
Data Source
AI summary
A substrate packaging structure includes an upper substrate, a lower substrate, a frit disposed there between for adhering the upper substrate and the lower substrate, and a light-diffusing component. The light-diffusing component is disposed on the upper substrate and corresponding to the frit. The light-diffusing component is utilized for diffusing a laser beam.