Semiconductor Substrate Pad Layout for Mixed Bump Solder Gaps
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Solution Overview
Problem
In semiconductor packages using mixed bumps with varying sizes, the difference in solder volumes between central and peripheral regions leads to gaps that cannot be filled, resulting in poor connections and reliability issues.
Innovation Solution
Designing semiconductor substrates with connection pads in the central region having a larger area and reduced height compared to those in the peripheral region, and incorporating recessed regions or insulating members to manage solder distribution and improve connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If mixed bumps with different sizes are used in central and peripheral regions, then the connection surface area is increased, but the solder volume difference causes gaps that cannot be filled resulting in poor connection reliability
Solution Approach 1:
The patent applies local quality by making the connection pads in the central region have a larger area and smaller height compared to the peripheral region. This creates spatially varying properties that compensate for the different solder volumes in mixed bump configurations, allowing gaps to be filled uniformly across both central and peripheral areas while maintaining high connection reliability.
2Quantity of substance
If connection pads in central region have larger area, then solder distribution is improved, but pad height must be reduced to prevent excessive gap formation
Solution Approach 1:
The patent employs parameter changes by systematically varying both the area and height parameters of connection pads based on their location. Central region pads have larger area and smaller height, while peripheral pads have smaller area and larger height. This coordinated parameter adjustment optimizes solder distribution while preventing excessive gap formation in any region.
3Reliability
If pre-solder is applied to FC-BGA technology, then connection reliability is improved, but cracks between different materials may occur
Solution Approach 1:
The patent applies local quality by creating spatially varying connection pad geometries that accommodate the stress distribution in mixed bump configurations. The larger area and smaller height of central pads compared to peripheral pads creates a gradient structure that reduces stress concentration and prevents cracks between different materials, eliminating the need for pre-solder while maintaining connection reliability.
Data Source
AI summary
A semiconductor substrate includes a substrate base, wherein the substrate base includes a first region and a second region around the first region, and the first region and the second region are defined as sections of a reference plane of the substrate base; a plurality of first connection pads in the first region, wherein an upper surface of each of the plurality of first connection pads has a first area in a horizontal direction, and each of the plurality of first connection pads has a first height in a vertical direction; and a plurality of second connection pads in the second region, wherein an upper surface of each of the plurality of second connection pads has a second area in the horizontal direction, and each of the plurality of second connection pads has a second height in the vertical direction, the first area is larger than the second area, and the first height is less than the second height.