Substrate Pad Assembly With Peeling-Stopper Interconnect
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing conductive structures in electronic devices face issues such as reduced adhesion between top and bottom pads due to defects or particle residue, leading to peeling, especially when subjected to external forces.
Innovation Solution
A substrate assembly with a first and second metal layer separated by an insulating layer containing openings, where the layers are connected through these openings, and a partition is included to prevent peeling by acting as a peeling stopper.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive structure with bottom pad, top pad, and opening is used for electrical connection, then electrical connection between IC chip and panel circuit is achieved, but adhesion between top pad and bottom pad is reduced due to defects or particle residue causing peeling
Solution Approach 1:
The conductive structure is segmented into multiple functional layers: bottom pad, intermediate conductive layer, top pad, and insulating layer with openings. This segmentation allows each layer to perform its specific function while reducing the direct contact area between top and bottom pads, thereby reducing peeling propagation while maintaining electrical connection reliability through the intermediate conductive layers and openings.
2Reliability
If top pad and bottom pad are directly connected through opening, then electrical connection is achieved, but peeling occurs under external force due to reduced adhesion
Solution Approach 1:
An intermediate conductive layer is introduced between the top pad and bottom pad, acting as a mediator that distributes mechanical stress and prevents direct peeling propagation. This intermediate layer, combined with the insulating layer structure, allows electrical connection to be maintained through multiple pathways while improving resistance to external forces that would otherwise cause peeling.
3Strength
If multiple layers and openings are added to prevent peeling, then adhesion and peeling resistance are improved, but device complexity increases
Solution Approach 1:
The insulating layer serves multiple functions: it provides electrical insulation between conductive layers, defines the openings for electrical connection, and its structural design (with controlled openings) contributes to stress distribution and peeling prevention. This multi-functionality reduces the need for separate dedicated components, thereby limiting the increase in device complexity while achieving improved peeling resistance.
Data Source
AI summary
A substrate assembly and an electronic device are provided. The substrate assembly includes a substrate, a first metal layer, a second metal layer, a first conductive layer, and an insulating layer. The first metal layer is disposed on the substrate. The second metal layer is disposed on the substrate. The first conductive layer is disposed between the first metal layer and the second metal layer, wherein the first conductive layer overlaps with a part of the first metal layer and overlaps a part of the second metal layer. The insulating layer is disposed between the first metal layer and the second metal layer and has an opening through which the part of the first metal layer and the second metal layer are electrically connected with each other.