Electronic Component Integrated Substrate Pad Segmentation
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Solution Overview
Problem
In electronic component integrated substrates, the narrow pitch of substrate connection members makes it difficult to form a wiring pattern between pads due to the small clearance between the pads, which complicates the stacking and sealing process.
Innovation Solution
The design includes a first substrate with a connection pad of larger diameter than the first pad and the open portion, allowing for a larger substrate connection member that ensures a sufficient space between the substrates, enabling easier filling of mold resin and maintaining clearance between pads, even with smaller diameter connection members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If substrate connection members are provided with a narrow pitch to miniaturize the substrate, then the substrate size is reduced, but the clearance between pads becomes small making it difficult to form wiring patterns
Solution Approach 1:
The pad structure is segmented into two distinct parts: the original pad on the first substrate and the connection pad on the second substrate. This segmentation allows the connection pad to serve dual purposes - maintaining electrical connection while providing space for wiring patterns, thus resolving the contradiction between miniaturization and manufacturability
Solution Approach 2:
The solution moves the pad function to another dimension by creating a connection pad on the second substrate that extends beyond the open portion. This dimensional extension allows wiring patterns to be formed in the lateral space around the connection pad without affecting the vertical electrical connection, enabling both narrow pitch and wiring formation
2Volume of moving object
If substrate connection members are provided with a narrow pitch, then substrate miniaturization is achieved, but the stacking and sealing process becomes complicated
Solution Approach 1:
The connection pad is preliminarily formed on the second substrate before stacking, extending beyond the open portion. This preliminary action simplifies the subsequent stacking and sealing processes by pre-establishing the alignment references and clearance spaces needed for mold resin filling, reducing process complexity despite narrow pitch requirements
3Volume of moving object
If the diameter of connection members is reduced to achieve narrow pitch, then substrate miniaturization is improved, but clearance between pads becomes insufficient
Solution Approach 1:
The clearance problem is solved by utilizing the lateral dimension rather than the vertical dimension. The connection pad extends beyond the open portion in the lateral direction, creating clearance space for wiring patterns without requiring larger vertical clearance, thus maintaining miniaturization while providing sufficient wiring space
Data Source
AI summary
An electronic component integrated substrate includes a first substrate including a first pad, a first solder resist layer provided with a first open portion that selectively exposes the first pad, and a connection pad formed on the first solder resist layer, and electrically connected to the first pad; a second substrate, stacked on the first substrate, including a second pad, and a second solder resist layer formed on the second pad and provided with a second open portion that selectively exposes the second pad; an electronic component mounted on the first substrate and sandwiched between the first substrate and the second substrate; and a substrate connection member that electrically connects the connection pad and the second pad with each other, the diameter of the connection pad being larger than each of the diameter of the first pad and the diameter of the second open portion.