Component-Containing Substrate Pad Trench for Flat Chip Mounting
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Solution Overview
Problem
Existing component-containing substrates face challenges in achieving stable flatness for semiconductor chip mounting, leading to difficulties in mounting the chip due to surface irregularities.
Innovation Solution
A component-containing substrate design featuring a substrate base with wiring and insulating layers, including a cavity with a trench on the pad that extends from the inside to the outside of the electronic component, allowing for stable bonding and flatness by eliminating warpage through trench-mediated air discharge during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor chip is mounted on a substrate surface, then the substrate can perform electronic functions, but the substrate surface may exhibit warpage or bulges that reduce flatness and make mounting difficult
Solution Approach 1:
The pad is segmented by introducing a trench that divides the pad into regions. This segmentation allows the pad to be bonded to the substrate while the trench region can accommodate volume changes without affecting the overall flatness of the mounting surface, thus resolving the contradiction between mounting stability and surface flatness
Solution Approach 2:
The trench acts as an intermediary structure between the electronic component and the substrate. It provides a pathway for air discharge and accommodates bonding-induced volume changes, preventing bulges while maintaining stable bonding, thereby enabling both reliable mounting and surface flatness
2Strength
If bonding is performed to secure the electronic component, then adhesion is improved, but air trapped during bonding causes bulges that reduce flatness
Solution Approach 1:
The trench structure extracts or removes the harmful factor (trapped air) from the bonding interface. By providing an open pathway through the pad, air can be discharged during bonding, preventing bulge formation while maintaining strong adhesion between the component and substrate
Solution Approach 2:
The trench creates a porous or open structure within the pad that allows air to escape during bonding. This controlled porosity enables complete bonding without trapping air, thus achieving both strong adhesion and surface flatness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate achieves stable flatness for semiconductor chip mounting, preventing bulges and ensuring proper alignment and adhesion, particularly effective for larger electronic components.
Implementation Method 1
A trench 231x is formed in a surface of a pad 231c... the trench 231x continues from an inside to an outside of a perimeter of the electronic component 10 in a plan view
Data Source
AI summary
A component-containing substrate includes a substrate base. The substrate base includes one or more wiring layers and one or more insulating layers and includes a cavity. The component-containing substrate further includes a pad at the bottom of the cavity and an electronic component bonded to a surface of the pad exposed in the cavity. A trench is formed in the surface of the pad, the trench continuing from the inside to the outside of the perimeter of the electronic component in a plan view.