Semiconductor Substrate Pad Alignment Under Warpage
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Solution Overview
Problem
Substrates in semiconductor devices may not be appropriately bonded due to warpage, leading to manufacturing challenges.
Innovation Solution
A method involving the formation of metal pads on substrates with positional corrections to align and bond them effectively, including translational, rotational, and enlargement/correction techniques to compensate for warpage and positional deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are bonded directly without correction, then the bonding process is simple and fast, but the substrates cannot be bonded appropriately due to warpage
Solution Approach 1:
The patent applies preliminary action by performing positional correction calculations and determining corrected positions of patterns before the actual bonding process. The system calculates the warpage of the first substrate in advance, determines the necessary position corrections, and prepares the corrected position information before substrates are bonded together, ensuring reliable bonding while maintaining process efficiency
Solution Approach 2:
The patent implements feedback by measuring the actual positions of patterns on the first substrate, comparing them with design positions to detect deviations caused by warpage, and using this feedback information to calculate and apply appropriate position corrections. This closed-loop approach ensures that bonding proceeds despite substrate warpage
2Manufacturing precision
If positional correction is applied to compensate for warpage, then substrate alignment improves, but the manufacturing process becomes more complex
Solution Approach 1:
The patent replaces complex mechanical alignment systems with computational methods. Instead of using complex mechanical adjustment mechanisms to compensate for warpage, the system uses image processing to detect pattern positions, computational algorithms to calculate corrections based on measured deviations and simulated warpage, and data processing to determine corrected positions, thereby achieving high precision alignment through information processing rather than mechanical means
Solution Approach 2:
The patent applies parameter changes by modifying the positional parameters of patterns based on calculated corrections. The system changes the position coordinates of patterns from their original design positions to corrected positions that compensate for warpage effects, allowing precise alignment to be achieved through parameter adjustment rather than physical substrate modification
Data Source
AI summary
A method of manufacturing a semiconductor device includes forming a first metal pad in each of a plurality of first regions on a first substrate so that warpage is generated on the first substrate. The method further includes forming a second metal pad in each of a plurality of second regions on a second substrate via a predetermined pattern. The method further includes bonding, after forming the first metal pad and the second metal pad, the first substrate with the second substrate. Moreover, the method further includes: making a correction, at a time of forming the predetermined pattern in each of the plurality of second regions on the second substrate, to change a position of the predetermined pattern in each of the plurality of second regions in a direction of being closer to a center of the second substrate for a first direction and to change the position of the predetermined pattern in a direction of being farther from the center of the second substrate for a second direction.