Liquid Crystal Substrate Pairing for Certification Rate
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Solution Overview
Problem
The existing liquid crystal panel manufacturing process often results in a low certification rate due to the pairing of certified and uncertified chips, leading to reduced production efficiency and increased costs.
Innovation Solution
A display unit process control method and system that detects and selects substrates with fewer uncertified chips, divides them into sorting levels, and pairs them based on these levels to calculate a certification matching degree, ensuring only high-matching pairs are assembled, thereby reducing waste and improving efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If random pairing of substrates is performed in the display unit process, then the pairing process is simple and fast, but the certification rate decreases significantly
Solution Approach 1:
The patent applies preliminary action by performing detection and classification of substrates before the pairing process. Substrates are classified into different levels based on the number and positions of uncertified chips detected in advance. This preliminary classification ensures that when pairing occurs, only compatible substrates are matched, thereby maintaining high certification rates while keeping the pairing process efficient.
Solution Approach 2:
The patent segments the substrate population into different levels based on certification status and defect patterns. By dividing substrates into multiple levels (e.g., level 1 for substrates with no uncertified chips, level 2 for substrates with one uncertified chip, etc.), the system enables precise matching between complementary levels, thereby improving the overall certification rate of paired products.
2Reliability
If strict certification control is implemented to maintain high certification rate, then product quality improves, but production efficiency decreases
Solution Approach 1:
The patent changes the parameter of substrate classification from binary (certified/uncertified) to multi-level classification based on the number and positions of uncertified chips. This parameter transformation allows for more nuanced matching strategies, where substrates can be paired at different levels to maximize certification rates without requiring absolute perfection from every individual substrate, thereby maintaining production efficiency.
3Quantity of substance
If substrates with uncertified chips are paired, then material utilization increases, but the certification rate and product quality decrease
Solution Approach 1:
The patent converts the harmful effect of uncertified chips into a beneficial matching mechanism. By classifying substrates according to their uncertified chip patterns and pairing complementary levels (e.g., level 1 with level 2, level 3 with level 4), the system ensures that uncertified chips on one substrate are compensated by certified chips on its partner substrate. This approach maximizes material utilization while maintaining high product quality through systematic compensation.
4Measurement precision
If detailed detection and classification of substrates is performed, then pairing accuracy improves, but process complexity increases
Solution Approach 1:
The patent applies local quality by focusing detection and classification efforts on specific critical areas of substrates where uncertified chips are most likely to occur and have the greatest impact on product quality. Rather than uniformly analyzing every substrate with equal detail, the system identifies and prioritizes critical regions, thereby achieving high pairing accuracy without proportionally increasing overall process complexity.
Data Source
AI summary
This application provides a display unit process control method and system. Before a first substrate and a second substrate enter a display unit process, according to quantities of uncertified chips on a first substrate and a second substrate, a first substrate and a second substrate which quantities of uncertified chips are less than preset quantities are selected as a certified first substrate and a certified second substrate; the certified first substrate and the certified second substrate are divided into a plurality of sorting levels according to locations of the uncertified chips on the first substrate and the second substrate; pairing and combination are performed on the first substrate and the second substrate according to the sorting levels in the display unit process; and a paired combination with a high matching degree is selected to enter an assembly process.